A data center interconnect is the network of high-capacity links that connects separate data centers so they can share files, run services together, and back each other up. Think of it as a set of highways between warehouses — it affects how fast and reliably users get services, how easily companies scale or move workloads, and how costly or risky a provider’s operations are, so it can materially influence revenue, expenses and customer trust.
hyperscale deploymentstechnical
Hyperscale deployments are large-scale builds of computing and storage capacity—think of many giant digital warehouses—designed to handle massive numbers of users and data without slowing down. For investors, they matter because companies that support or operate these deployments often see predictable, high-volume demand, steady revenue growth, and significant upfront costs, so success or failure can affect profitability, cash needs, and long-term competitive advantage.
gpu compute clusterstechnical
GPU compute clusters are groups of graphics processing units (GPUs) wired together to run many heavy calculations at once, like a team of high-speed cooks working in parallel in a commercial kitchen. Investors care because these clusters accelerate tasks such as artificial intelligence, scientific simulation, and high-frequency trading, and they can drive demand for hardware, cloud services, and software, affecting revenue growth, capital spending and competitive advantage.
signal integritytechnical
Signal integrity is the ability of an electronic wire, circuit or connector to carry data signals cleanly and reliably without distortion or errors, like keeping a phone call clear despite background noise. For investors, it matters because poor signal integrity leads to malfunctioning or slower products, higher development and warranty costs, and can limit a company’s ability to sell into high‑speed markets such as data centers, telecom and advanced consumer electronics.
passive copper cable assembliestechnical
Passive copper cable assemblies are physical cables and connectors made from copper that carry electrical signals without any built-in electronics or power amplification. They are like a garden hose for data: simple, durable paths that move information between devices but don’t boost or process the signal, so distance and speed limits depend on the cable’s design. Investors watch demand and pricing for these components because they are basic, high-volume parts in networks and electronics supply chains, and shifts in their use can signal broader trends in infrastructure investment and product cycles.
active copper cable assembliestechnical
Active copper cable assemblies are data cables that combine copper wiring with small built-in electronic components that boost and shape high-speed signals so they can travel farther and faster than ordinary copper wires. For investors, they matter because they offer a cost-effective, lower-power alternative to optical fiber for short- to medium-distance connections in data centers and networking gear, affecting product costs, performance, and market demand for hardware makers.
linear pluggable opticaltechnical
A linear pluggable optical is a small, hot‑swap module that plugs into networking gear to send and receive data over fiber cables, like a specialized USB stick for high‑speed internet links. Investors watch its adoption because it affects how easily data centers and telecoms upgrade speeds and capacity, which in turn influences sales, pricing power and competitive position for companies that make or use these modules.
optical interconnectstechnical
Optical interconnects are systems that use light instead of electrical signals to move data between parts of computers, data centers, or telecom equipment, like replacing copper wires with tiny light pipes. They matter to investors because they can greatly increase speed and capacity while lowering power use and heat, making digital networks faster and cheaper to scale; think of swapping a crowded city road for a high-speed rail line that carries much more traffic efficiently.
System architects to present power-efficient interconnect solutions for hyperscale AI infrastructure
CAMARILLO, Calif.--(BUSINESS WIRE)--
Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, will showcase artificial intelligence (AI) data center connectivity expertise at DesignCon 2026 (Feb. 24-26, Santa Clara Convention Center) through technical presentations and private demonstrations addressing critical power efficiency and bandwidth challenges in hyperscale deployments.
Semtech Demonstrates AI Data Center Connectivity Expertise at DesignCon 2026
According to Dell’Oro Group, data center interconnect accounted for the most bandwidth growth over the past year, driven by large deployments from cloud providers. This trend is expected to continue beyond 2026 as hyperscalers expand AI data centers across multiple buildings to tap into different electricity grids for power-hungry GPU compute clusters.
As data center interconnect drives unprecedented bandwidth growth, Semtech’s DesignCon presence reinforces its position as a trusted partner for infrastructure architects navigating the transition to 400G, 800G, and 1.6T interconnects.
“Our customers are navigating unprecedented challenges—scaling GPU clusters while managing power constraints and signal integrity at multi-terabit speeds,” said Amit Thakar, vice president of signal integrity product marketing at Semtech. “DesignCon provides the ideal platform to share technical insights on both copper and optical approaches that help infrastructure architects optimize for performance, efficiency, and scalability.”
Semtech Technical Presentations
“400G Channels for AI Applications: Passive & Active Copper Cable Assemblies to Enable Scale Up/Scale Out”
Wednesday, Feb. 25, 11:15 AM PT, Ballroom E
Joint presentation with TE Connectivity examining copper solutions for high-density GPU clusters. Semtech Presenters: Edward Frlan, Senior System Architect; Sameh Elnaggar, Electrical Engineer.
“200G Per Lane Linear Pluggable Optical Channels for Power-Efficient AI Interconnects”
Thursday, Feb. 26, 2:00 PM PT, Ballroom B
Semtech Presenters: Mark Kimber, Sr. Director of Product Definition, and Edward Frlan present Semtech’s approach to power-efficient optical interconnects.
Visit Semtech at DesignCon 2026
Semtech will host private demonstrations throughout the conference in a dedicated meeting room, offering hands-on evaluation of connectivity solutions for AI data center architectures. Schedule a meeting or learn more at www.semtech.com.
About Semtech
Semtech Corporation (Nasdaq: SMTC) is a leading provider of high-performance semiconductor, IoT systems and cloud connectivity service solutions dedicated to delivering high-quality technology solutions that enable a smarter, more connected and sustainable planet. Our global teams are committed to empowering solution architects and application developers to develop breakthrough products for the infrastructure, industrial and consumer markets. To learn more about Semtech technology, visit us at Semtech.com or follow us on LinkedIn or X.
Semtech and the Semtech logo are registered trademarks or service marks of Semtech Corporation or its subsidiaries. All other trademarks, service marks and trade names mentioned in this press release are the property of their respective owners.
