Tower Semiconductor Ltd. reports developments tied to its role as a pure-play specialty foundry for high-value analog semiconductor solutions. The company provides technology, development and process platforms for IDMs and fabless companies across consumer, industrial, automotive, mobile, infrastructure, medical, aerospace and defense markets.
Recurring updates cover analog and specialty process platforms including SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS and non-imaging sensors, displays, integrated power management, silicon photonics and MEMS. Company announcements also address customer and partner demonstrations, aerospace and defense foundry applications, AI infrastructure and optical networking technologies, quarterly financial results, conference participation, and the multi-fab manufacturing footprint in Israel, the United States, Japan and Italy.
Tower Semiconductor (TSEM) announced its 2026 Technical Global Symposium in the United States, to be held on November 17, 2026, in Santa Clara, California.
The event will gather customers, partners and industry leaders to discuss technologies and market trends in AI infrastructure, high-performance computing, advanced connectivity and intelligent sensing. It follows a 2026 symposium held in Shenzhen and is presented as reinforcing Tower’s global customer engagement and technology leadership efforts.
The program includes a CEO keynote on company growth and roadmap, an executive panel on next-generation data center architectures, and technical sessions on silicon photonics, SiGe, RF/RF SOI, power management, sensors and display platforms. Registration and agenda details are available on the event webpage.
Tower Semiconductor (TSEM) and NewPhotonics have begun high-volume shipments of laser-integrated, serviceable optical engine photonic integrated circuits (PICs) for AI data-center interconnects.
The volume-production NPG102 PICs support data rates from 800G to 1.6T, using 200G-per-lane designs and heterogeneously integrated lasers on Tower’s PH18DA silicon photonics platform. The devices target FRO/LRO/LPO and Extra-Dense Packaged Optics pluggable modules and Near-Packaged Optics socket pluggable solutions for scale-out and scale-up AI architectures. CPX-MSA compliant NPC505 chipsets for 6.4T NPO applications are planned to enter volume shipment in the first half of 2027.
Tower Semiconductor (TSEM) will showcase its silicon photonics and Silicon Germanium (SiGe) solutions at ECOC 2026, held September 21–23, 2026 at FYCMA in Malaga, Spain, booth C1014.
The company plans to present its high-volume, high-performance silicon photonics platform used in datacenter and telecom optical transceivers and in applications such as near- and co-packaged optics for AI clusters, DWDM lasers, optical circuit switching, FMCW LiDAR for Physical AI, and quantum computing. Tower will also feature its SiGe BiCMOS solutions, designed to complement its SiPho platform to meet higher-bandwidth, lower-latency and lower-power needs of next-generation AI infrastructure. Company representatives will be available during the event for roadmap discussions.
Tower Semiconductor (NASDAQ/TASE: TSEM) announced that company representatives will participate in two upcoming investor events: the 2026 Jefferies Semiconductor, IT Hardware and Communications Technology Conference on August 25–26, 2026 at the Four Seasons Hotel in Chicago, and the Benchmark-StoneX 13th Annual Tech, Media and Telecom Conference on September 10, 2026 at the New York Athletic Club in New York.
According to Tower Semiconductor, investors will have opportunities for one-on-one meetings with company representatives and can arrange meetings through the conference organizers or by emailing the investor relations team at towersemi@kcsa.com.
Tower Semiconductor (NASDAQ/TASE: TSEM) and OpenLight announced that OpenLight’s photonic Process Design Kit (PDK) for Tower’s PH18DA indium phosphide (InP)-on-silicon photonics platform is now available within Cadence electronic design automation (EDA) tools. The jointly developed PDK lets customers design photonic integrated circuits (PICs) in a familiar IC design environment and move more efficiently toward production.
The PH18DA ecosystem now combines OpenLight’s photonics IP, Tower’s process and manufacturing capabilities, and Cadence’s EDA environment to support monolithic PICs integrating active components such as lasers, modulators, and amplifiers. According to Tower Semiconductor, this enables development of 400G and 1.6T laser-integrated PICs and co-optimized photonic and electronic ICs for next-generation near- and co-packaged optics, targeting applications including optical interconnects, AI infrastructure, and sensing. OpenLight also highlights a recent $50 million Series A-1 funding round, bringing its total funding to $84 million.
Tower Semiconductor (NASDAQ/TASE: TSEM) reported record second quarter 2026 revenue of $460 million, up 24% year over year, with gross profit of $138 million and operating profit of $90 million. Net profit attributable to the company was $90.8 million, yielding basic EPS of $0.80 versus $0.42 a year earlier.
Cash from operating activities reached $177 million, while investments in property and equipment were $187 million. The company guided third quarter 2026 revenue to $520 million (±5%), implying 31% YoY and 13% QoQ growth. Tower highlighted strong silicon photonics (SiPho) momentum, with annual revenue run rate rising to $680 million from $180 million year over year, and raised its 2028 target model to $3.6 billion revenue and $1.2 billion net profit.
Tower Semiconductor (NASDAQ/TASE: TSEM) announced a dual-track strategic expansion of its 300mm Silicon Photonics (SiPho), Silicon Germanium (SiGe) and advanced packaging capacity in Japan, supported by approximately $1 billion in grants from the Government of Japan. Tower plans about $3 billion of its own investment for this initiative.
Track one repurposes the Arai facility (former Fab 6) for 300mm SiPho and advanced packaging, with full production readiness targeted for Q4 2027 and maximization of Fab 7 output in Uozu. Reflecting this plan, Tower is updating its business model, targeting 2028 revenue of $3.6 billion and net profit of $1.2 billion. Track two, to begin in parallel following signing and closing of related agreements, will add a new 300mm facility adjacent to Fab 7, expected to provide a multi-fold increase in SiPho and SiGe capacity and to be highly accretive beginning in 2029.
Tower Semiconductor (NASDAQ: TSEM) will release its Q2 2026 earnings on Tuesday, August 4, 2026, followed by a conference call discussing Q2 2026 results and Q3 2026 guidance at 10:00 a.m. Eastern Time.
The call will be webcast via the company’s Investor Relations website, with a 90-day replay.
Tradr ETFs launched five new Cboe-listed 2X long single-stock ETFs on July 1, 2026, delivering 200% of the daily performance of CIEN, QNT, RMBS, TSEM and TTMI. The lineup includes first-to-market leveraged exposures on Quantinuum (QNT) and TTM Technologies (TTMI).
Tradr now offers 72 leveraged ETFs with about $10 billion in assets, targeting sophisticated investors seeking short-term, high-conviction trades, and highlights substantial leverage risks, including potential total loss if the underlying moves more than 50% adversely in a day.
Tradr ETFs announced plans to launch five new single-stock leveraged ETFs on July 1, each seeking 2x (200%) the daily performance of its underlying stock. The Cboe-listed funds will track CIEN, QNT, RMBS, TSEM and TTMI through tickers CIEX, QNTU, RMBX, TSEU and TTMX.
These ETFs are designed for sophisticated investors and professional traders with high-conviction, short-term views and carry significant leverage-related risks, including potential total loss from large adverse single-day moves.