Welcome to our dedicated page for Tower Semiconductor news (Ticker: TSEM), a resource for investors and traders seeking the latest updates and insights on Tower Semiconductor stock.
Tower Semiconductor Ltd (TSEM) is a global leader in specialty analog and mixed-signal semiconductor manufacturing. This page serves as the definitive source for official company announcements, financial updates, and technology developments. Investors and industry professionals will find timely updates on earnings reports, strategic partnerships, product innovations, and operational milestones.
Our curated collection features press releases covering quarterly financial results, manufacturing expansions, and technology partnerships across automotive, industrial, and consumer electronics sectors. Stay informed about TSEM's advancements in RF solutions, power management ICs, and CMOS image sensor technologies through verified primary sources.
Key updates include executive leadership changes, regulatory filings, and capacity expansion announcements from Tower Semiconductor's global fabrication facilities. Bookmark this page for direct access to critical information affecting the company's market position and semiconductor industry trends.
Tower Semiconductor (NASDAQ/TASE: TSEM), a leading foundry specializing in high-value analog semiconductor solutions, has announced its participation in two major investor conferences. The company will attend the 22nd Annual Craig-Hallum Institutional Investor Conference in Minneapolis on May 28, 2025, and the 53rd Annual TD Cowen Technology, Media & Telecom Conference in New York on May 29, 2025. Investors will have the opportunity to schedule one-on-one meetings with company representatives through conference organizers or by contacting Tower's investor relations team.
Tower Semiconductor (NASDAQ/TASE: TSEM) has scheduled its first quarter 2025 earnings release for Wednesday, May 14, 2025. The company will host a conference call on the same day at 10:00 a.m. Eastern Time to discuss Q1 2025 financial results and Q2 2025 guidance.
The conference call will be accessible via webcast through Tower Semiconductor's Investor Relations website. Participants must pre-register to receive dial-in details and a unique PIN. The teleconference recording will remain available for replay for 90 days.
Tower Semiconductor (NASDAQ/TASE: TSEM) and Alcyon Photonics have announced a strategic collaboration to accelerate photonics integration development. The partnership combines Tower's high-volume Silicon Photonics (SiPho) manufacturing platform with Alcyon's advanced photonic design capabilities.
Key highlights of the collaboration include:
- Development of silicon-validated, high-performance photonic building blocks and circuits
- Alcyon's design techniques maintain channel drifts below 3 nm despite fabrication variations up to 30 nm
- Focus on CWDM solutions for data center networking in O band
- Advancement in coherent communications across C+L bands for enhanced bandwidth
The partnership aims to provide customers with consistent, high-yield results and accelerate the development cycle for next-generation optical applications in datacom, telecom, and sensing markets.
Tower Semiconductor (TSEM) has been honored with a Supplier Excellence Award from Northrop Grumman (NOC) for its outstanding performance in supporting national security technologies. The recognition was announced during Northrop Grumman's recent Supplier Excellence Awards Ceremony.
Ken Brown, VP of Enterprise Global Supply Chain at Northrop Grumman, highlighted Tower's contribution to delivering technologies that enhance national security for the U.S. and its allies. The partnership focuses on providing innovative and cost-effective military and security solutions.
Mike Scott, Sr. Director and General Manager of Tower's Aerospace & Defense Business Unit, expressed pride in receiving this recognition, emphasizing the company's dedication to delivering exceptional quality, reliability, and service to Aerospace & Defense customers through advanced technologies and manufacturing capabilities.
OpenLight and Tower Semiconductor (NASDAQ/TASE: TSEM) have successfully demonstrated a 400G/lane modulator on Tower's integrated silicon photonics platform PH18DA. The innovation achieved a better than 3.5db extinction ratio using PAM-4 modulation format at 0.6 volts peak-to-peak drive voltage.
The demonstration, built using OpenLight's IP on Tower's existing platform, supports next-generation optical communication architectures from 100G to 400G/lane. Operating across all four CWDM wavelengths, it enables a commercially viable path for DR8 and FR4 next-generation 3.2Tb solutions.
The technology offers significant advantages for datacom and AI applications, including small size, high bandwidth, low drive voltage, and volume manufacturability. The platform also supports heterogeneous integration of modulators, lasers, and optical amplifiers on a single, compact photonic integrated circuit (PIC).
OpenLight and Tower Semiconductor (NASDAQ/TASE: TSEM) have successfully demonstrated a 400G/lane modulator on Tower's PH18DA integrated silicon photonics platform. The demonstration achieved a better than 3.5db extinction ratio using PAM-4 modulation format at 0.6 volts peak-to-peak drive voltage.
Built using OpenLight's IP on Tower's existing platform, which already supports 100G and 200G/lane, this innovation enables a scalable solution for high-speed data transfer in cloud computing, AI and ML applications. Operating across all four CWDM wavelengths, it provides a commercially viable path for DR8 and FR4 next-generation 3.2Tb solutions.
The platform offers heterogeneous integration of 400G modulators, lasers, and optical amplifiers on a single, compact photonic integrated circuit (PIC), providing advantages in size, bandwidth, and low drive voltage while maintaining volume manufacturability.
Tower Semiconductor (NASDAQ/TASE: TSEM) and Innolight have expanded their collaboration to ramp up production of next-generation Silicon Photonics (SiPho) solutions for AI and data centers. The breakthrough technology reduces external optical components and halves the required number of lasers per module, streamlining optical module design and improving cost efficiency.
The partnership focuses on delivering solutions for:
- 100Gbps per lane (400G/800G)
- 200Gbps per lane (1.6T)
- Future 400Gbps per lane (3.2T) optical modules
Tower's new SiPho platform features industry-leading edge coupling efficiency and higher-performance modulators, enabling reduced complexity, improved system reliability, and enhanced supply chain robustness. The collaboration aims to meet the increasing demand for high-speed optical connectivity in AI-driven data centers and cloud infrastructure.
Tower Semiconductor (NASDAQ/TASE: TSEM) announced its participation in the 2025 Applied Power Electronics Conference (APEC) from March 17-19 in Atlanta, Georgia. The company will showcase its advanced power management technology platform, featuring its 300mm 65nm 3.3V-based BCD solution.
The presentation will highlight Tower's power management solutions targeting Automotive, AI, Mobile PMIC, and Data Center power delivery applications. The company's 0.18μm (200mm) and 65nm (300mm) Bipolar-CMOS-DMOS (BCD) platforms support various applications including driver ICs, battery management, and high-voltage gate drivers.
Dr. Mete Erturk, Sr. Director of Power Management Marketing, will present 'Tower Semiconductor's BCD Technology Foundry Offerings: From Automotive to Datacenter Power' on March 19, 2025, at 12:45 PM in room A312.
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