Welcome to our dedicated page for Tower Semiconductor news (Ticker: TSEM), a resource for investors and traders seeking the latest updates and insights on Tower Semiconductor stock.
Tower Semiconductor Ltd (NASDAQ/TASE: TSEM) is a pure-play specialty semiconductor foundry focused on high-value analog semiconductor solutions. News related to Tower Semiconductor often centers on its technology platforms, collaborations with customers and partners, and its role in markets such as consumer, industrial, automotive, mobile, infrastructure, medical, and aerospace and defense.
Recent announcements highlight collaborations in Silicon Photonics (SiPho) and power management, including work on AI datacenter fabrics, optical interconnects, and high-efficiency power conversion for servers and AI compute systems. Other news items describe silicon photonics-based FMCW LiDAR for automotive and Physical AI applications, high-speed imaging solutions with embedded analog AI, and wafer-scale 3D-IC integration that combines SiPho and SiGe BiCMOS processes for Co-Packaged Optics and data center applications.
Investors and industry followers can also find updates on Tower Semiconductor’s participation in global technology and investor conferences, as well as its Technical Global Symposium series, which showcases its analog, RF, sensor, display, power management, and photonics capabilities. Earnings releases and Form 6-K filings provide additional context on the company’s operations and strategic focus.
This news page aggregates these developments, offering a single view into Tower Semiconductor’s ongoing technology announcements, market collaborations, financial updates, and corporate events. Users interested in analog foundry technologies, silicon photonics, RF, sensors, and power management can use this feed to follow how Tower Semiconductor’s platforms are being applied across AI, connectivity, automotive, and industrial markets.
Tower Semiconductor (NASDAQ: TSEM) announced a collaboration with NVIDIA on 1.6T data center optical modules using Tower's silicon photonics platform on February 5, 2026. The company says its SiPho technology can enable up to 2x data-rate versus prior silicon photonics solutions, targeting higher bandwidth and throughput for AI infrastructure.
This work is positioned to support NVIDIA networking protocols and scale high-speed optical interconnects for data center and AI deployments.
Tower Semiconductor (NASDAQ/TASE: TSEM) announced company representatives will attend the Susquehanna 15th Annual Technology Conference on Thursday, February 26, 2026 at the Lotte New York Palace Hotel.
Investors may request one-on-one meetings; interested parties should contact conference organizers or email investor relations at towersemi@kcsa.com for meeting arrangements.
Tower Semiconductor (NASDAQ: TSEM) will release its fourth quarter and fiscal year 2025 earnings on Wednesday, February 11, 2026. The company will host a conference call the same day at 10:00 a.m. Eastern Time to discuss Q4 and full-year 2025 results and provide first-quarter 2026 guidance.
The call will be webcast via the Investor Relations site at https://ir.towersemi.com/. Participants must pre-register to receive dial-in details and a unique PIN; a confirmation email will include all necessary information. The teleconference replay will be available for 90 days.
Tower Semiconductor (NASDAQ/TASE: TSEM) announced a strategic collaboration with LightIC to apply Tower’s mature silicon photonics foundry platform to LightIC’s FMCW LiDAR products, including the Lark long-range automotive LiDAR and FR60 compact LiDAR for robotics and Physical AI.
The release cites Yole Group forecasts: automotive LiDAR market to grow from $859M (2024) to $3.6B (2030) (CAGR 24%) and the broader LiDAR market to reach $6.3B by 2027. The partnership aims to improve optical integration, SWaP-C, and manufacturability for velocity-aware 4D FMCW LiDAR.
Tower Semiconductor (NASDAQ/TASE: TSEM) announced company representatives will attend the 28th Annual Needham Growth Conference on Tuesday, January 13 and Wednesday, January 14. The event takes place at the Lotte New York Palace Hotel in New York and will include opportunities for one-on-one investor meetings. Interested investors are instructed to contact the conference organizers or email investor relations at towersemi@kcsa.com.
Tower Semiconductor (NASDAQ/TASE: TSEM) said company representatives will attend Nomura’s CES Technology Conference at the Bellagio Hotel in Las Vegas on Monday, January 5 and Tuesday, January 6, 2026.
The company noted there will be opportunities for investors to request one-on-one meetings with management and provided an investor relations contact for scheduling.
- Event: Nomura’s CES Technology Conference
- Dates: January 5–6, 2026
- Location: Bellagio Hotel, Las Vegas
- Contact: towersemi@kcsa.com
Tower Semiconductor (NASDAQ/TASE: TSEM) announced company representatives will participate in the Barclays 23rd Annual Global Technology Conference on Wednesday, December 10, 2025 at the Palace Hotel in San Francisco.
The company said investors will have an opportunity for one-on-one meetings with its representatives and interested investors should contact the conference organizers or email investor relations at towersemi@kcsa.com for scheduling.
Tower Semiconductor (NASDAQ/TASE: TSEM) and Switch Semiconductor announced the SW2001, a monolithic 12-V Point-of-Load buck regulator built on Tower’s 65nm BCD 300mm platform. The SW2001 uses Switch’s Novo-Drive gate driver and ultra-low-Ron LDMOS devices to achieve up to 87% efficiency converting 12 V to 1 V at a 20 A load while reducing switch-node overshoot and radiated emissions.
Sampling with evaluation boards starts in Q1 2026; volume production is planned later in 2026. The device ships in a compact 3×4 mm 21-lead package and targets servers, AI accelerators, cloud storage, and telecom.
Tower Semiconductor (NASDAQ/TASE: TSEM) on November 12, 2025 announced expansion of its mature 300mm wafer bonding technology to enable wafer-scale 3D‑IC integration across its Silicon Photonics (SiPho) and SiGe BiCMOS (EIC) processes.
The offering supports Co‑Packaged Optics (CPO) use cases, integrates multiple PDKs on a single stacked chip, and includes Cadence Virtuoso design-flow support for co-simulation, co-verification, and unified layout/verification of multi-technology stacked die.
Tower says it has demonstrated precision alignment and reliability for the wafer bonding process and is providing the Cadence-enabled reference flow to customers.
Tower Semiconductor (NASDAQ/TASE: TSEM) reported Q3 2025 results and guided Q4 2025 revenue to a record $440 million. Q3 revenue was $396 million (QoQ +6%), gross profit $93 million, and net profit $54 million (EPS $0.48 basic, $0.47 diluted). Operating cash flow in Q3 was $139 million and capex (investments in property and equipment, net) was $103 million. The company announced an additional $300 million investment to expand SiPho and SiGe capacity, a Newport Beach Fab3 expansion, and a Newport Beach lease extension enabling up to an extra 3.5 years at an average of $24 million per year. A webcast and conference call are scheduled for Nov 10, 2025.
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