Welcome to our dedicated page for Tower Semiconductor news (Ticker: TSEM), a resource for investors and traders seeking the latest updates and insights on Tower Semiconductor stock.
Tower Semiconductor Ltd. reports developments tied to its role as a pure-play specialty foundry for high-value analog semiconductor solutions. The company provides technology, development and process platforms for IDMs and fabless companies across consumer, industrial, automotive, mobile, infrastructure, medical, aerospace and defense markets.
Recurring updates cover analog and specialty process platforms including SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS and non-imaging sensors, displays, integrated power management, silicon photonics and MEMS. Company announcements also address customer and partner demonstrations, aerospace and defense foundry applications, AI infrastructure and optical networking technologies, quarterly financial results, conference participation, and the multi-fab manufacturing footprint in Israel, the United States, Japan and Italy.
Tower Semiconductor (NASDAQ:TSEM) announced signed Silicon Photonics (SiPho) contracts totaling $1.3 billion for 2027 revenue with its largest customers, alongside $290 million of capacity-reservation prepayments.
The company reported even larger contracted wafer commitments for 2028, a broad base of 50+ active SiPho customers, and a global capacity ramp aligned with a 2028 financial model targeting $2.8 billion revenue and $750 million net profit.
Tower Semiconductor (NASDAQ/TASE:TSEM) reported first quarter 2026 revenue of $414 million, up 15% year over year from $358 million. Gross profit rose to $111 million and operating profit to $65 million, versus $73 million and $33 million in 2025. Net profit reached $65 million, or $0.58 basic EPS.
Cash from operating activities excluding customer prepayments was $225 million, with $290 million silicon photonics prepayments and $156 million in net capital investments. Q2 2026 revenue is guided to a company-record $455 million (±5%), and S&P Maalot reaffirmed an “ilAA” rating with a positive outlook.
Tower Semiconductor (NASDAQ/TASE: TSEM) announced company representatives will attend multiple investor conferences in May and June 2026. Events include Oppenheimer Israeli (May 18), TD Cowen TMT (May 27), Craig-Hallum (May 28) and Mizuho Global Tech (June 9–10).
Investors may request one-on-one meetings by contacting conference organizers or emailing investor relations at towersemi@kcsa.com.
Tower Semiconductor (NASDAQ: TSEM) and Axiro Semiconductor announced availability of U.S.-fabricated Ku- and X-band radar beamforming ICs (BFICs) built on Tower's SiGe technology on April 27, 2026.
The BFICs are ramping to volume production, designed for defense radar and satcom, and positioned to reinforce secure U.S. supply chains for mission-critical radar applications.
Tower Semiconductor (NASDAQ/TASE: TSEM) will release its Q1 2026 earnings on Wednesday, May 13, 2026 and will host a conference call the same day at 10:00 a.m. ET. The call will cover Q1 2026 results and Q2 2026 guidance.
According to Tower Semiconductor, the call will be webcast via the company Investor Relations site, requires pre-registration for dial-in details and PIN, and will be available for replay for 90 days.
Tower Semiconductor (NASDAQ/TASE: TSEM) announced a strategic restructuring to take full ownership of its 300mm Fab 7 in Japan and transfer full ownership of the 200mm Fab 5 to Nuvoton affiliate NTCJ.
The transaction targets an April 1, 2027 close, includes mutual long‑term supply agreements to avoid customer disruption, and contemplates expanding Uozu 300mm capacity to about 4x current levels pending METI subsidy and customary approvals.
Tower Semiconductor (NASDAQ/TASE: TSEM) and Nuvoton announced a strategic restructuring of TPSCo effective upon closing, expected April 1, 2027, subject to customary conditions and regulatory approvals. Tower will acquire full ownership and control of TPSCo's 12‑inch fab and foundry business. NTCJ will acquire TPSCo's 8‑inch fab and foundry business and pay $25 million to Tower on closing. The parties will provide reciprocal production services and aim to maintain continuity of customer engagements, operations, development programs and employee stability across both facilities.
Tower Semiconductor (NASDAQ/TASE: TSEM) and Coherent (NYSE: COHR) demonstrated 400 Gbps/lane data transmission using a silicon Mach-Zehnder modulator built in a production-ready silicon photonics (SiPho) process on March 23, 2026.
The demo achieved a clear open eye at 420 Gb/s PAM4, used Coherent’s InP CW high-power laser, and targets next-generation 3.2T optical transceivers for pluggable and co-packaged optics in datacenter links.
Tower Semiconductor (NASDAQ/TASE: TSEM) released its Gen3 BCD LDMOS power management platform to address rising AI data center power demands and high-current applications. The platform targets higher efficiency, lower heat, and die-size reduction for power management ICs, and targets Monolithic Smart Power Stage/DrMOS markets.
Tower will present these developments at APEC 2026 March 23–25 in San Antonio (booth #1455); a presentation by Dr. Mete Erturk is scheduled March 24, 3:45–4:15 PM at Expo Theater 3.
Tower Semiconductor (NASDAQ/TASE: TSEM) and Oriole Networks announced a collaboration to deliver nanosecond optical circuit switching for AI scale-up and scale-out networking using Tower's silicon photonics platform. The partnership targets ultra-low, deterministic tail latency and high-bandwidth optical interconnects for AI data centers.
The work aims to integrate lasers, amplification, switching, modulation, and detection on a single SiPho platform and to commercialize Oriole's PRISM networking architecture; company representatives will attend OFC 2026, March 17–19 in Los Angeles.