Tower Semiconductor and Marvell Ship Over Five Million Coherent Photonic ICs

Tower Semiconductor (NASDAQ/TASE:TSEM) and Marvell reported shipping over five million coherent photonic ICs for AI-driven data center interconnect networks.

Rhea-AI Summary

Tower Semiconductor (NASDAQ/TASE:TSEM) and Marvell reported shipping over five million coherent photonic ICs for AI-driven data center interconnect networks. Tower’s silicon photonics platform supports high-bandwidth, energy-efficient connectivity and advanced capabilities such as non-silicon material integration, 3D electronic integration and V-groove-based optical packaging.

Positive

• Over five million coherent photonic ICs shipped with Marvell
• Targeting AI-driven data center interconnect bandwidth and efficiency needs
• Advanced SiPho platform with non-silicon material integration
• 3D integration of electronics for next-generation coherent technologies
• Enablement of advanced optical packaging such as V-Grooves

Negative

• None.

Argus Jun 18 session

+7.34% close to close Open Argus

Details

News Market Reaction – TSEM

On Jun 18, the day this news came out, TSEM closed 7.34% above the previous close.

Data tracked by StockTitan Argus for the Jun 18 session.

Key Figures

Coherent PIC shipments: over five million coherent photonic ICs

Coherent PIC shipments

over five million coherent photonic ICs

Cumulative shipments to Marvell global customers

Historical Context

5 past events · Latest: Jun 15

5 events

1. Jun 15

   Supply agreement

   24h Move

   +9.1%

   Multi‑year InP epiwafer deal supporting AI data center optical connectivity.

2. May 13

   SiPho contracts

   24h Move

   +22.6%

   Signed $1.3B 2027 SiPho contracts plus capacity prepayments and 2028 targets.

3. May 13

   Q1 2026 earnings

   24h Move

   +22.6%

   15% YoY revenue growth with strong profit metrics and record Q2 guidance.

4. May 04

   Conference participation

   24h Move

   -1.4%

   Announcement of participation in several upcoming investor conferences.

5. Apr 27

   Defense IC launch

   24h Move

   +1.4%

   High‑power SiGe ICs for secure U.S. defense radar and satcom applications.

24h Move is the share-price change in the day after each event; other market factors may also have contributed.

Key Terms

silicon photonics, photonic integrated circuits, coherent optical transceivers, 3d integration

4 terms

silicon photonics technical

"Tower’s advanced silicon photonics platform enables high-bandwidth, energy-efficient data center connectivity"

Silicon photonics is the technology that uses tiny structures etched into silicon chips to generate, control and detect light for moving data and sensing, essentially putting optical fiber functions onto a computer chip. For investors, it matters because it can dramatically increase data speed and energy efficiency in data centers, telecom networks and advanced sensors, potentially lowering costs and enabling new products much like replacing many metal wires with faster, low-power optical highways.

photonic integrated circuits technical

"has shipped over five million coherent photonic integrated circuits (PICs) to Marvell global customers"

Photonic integrated circuits are chips that use tiny optical components to generate, route and detect light instead of moving electrical signals, performing functions similar to electronic computer chips but with photons. They matter to investors because they can enable much faster data transfer and lower power use in telecommunications, data centers and sensing, creating new markets and potential cost advantages — but they also require specialized manufacturing and carry technology and supply risks.

coherent optical transceivers technical

"This is especially true in the area of coherent optical transceivers"

Coherent optical transceivers are devices that send and receive very large amounts of data over fiber-optic cables by encoding information into the light’s properties, allowing one fiber to carry far more traffic than older light transmitters. Think of them as advanced multi-lane highways for data: they boost network capacity and distance without laying more cable, which matters to investors because they can lower network costs, enable higher revenue from bandwidth-hungry services, and drive demand for equipment vendors and service providers.

3d integration technical

"including process capabilities, such as the integration of non-silicon materials, the 3D integration of electronics"

3D integration is a way of building computer chips by stacking multiple layers of circuitry on top of each other and connecting them with tiny vertical links, like turning a single-story house into a compact, multi-story apartment. For investors, it matters because stacking can boost speed, reduce power use, and pack more capability into a smaller footprint, which can lead to better-performing products, lower production costs per function, and new market opportunities for chip makers.

AI-generated analysis. How Rhea-AI works. Not financial advice.

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Tower’s advanced silicon photonics platform enables high-bandwidth,
energy-efficient data center connectivity

MIGDAL HAEMEK, Israel, June 18, 2026 - Tower Semiconductor (NASDAQ/TASE: TSEM), the leading foundry for high-value analog semiconductor solutions, today announced a significant milestone. The company, in partnership with Marvell Technology, has shipped over five million coherent photonic integrated circuits (PICs) to Marvell global customers, delivering advanced, high-performance photonics solutions to address the growing bandwidth and efficiency demands of AI-driven data center interconnect (DCI) networks.

Coherent PICs are complex because they must control the phase and polarization of light, not just the amplitude. The design and process requirements for these PICs are far more stringent compared to simpler direct-detect chips.

“As optical transceiver applications and requirements continue to evolve, photonics platforms must evolve to meet these requirements. This is especially true in the area of coherent optical transceivers,” said Dr. Ed Preisler, Vice President and General Manager of the RF Business Unit at Tower Semiconductor. “We are proud to collaborate with Marvell to stay at the forefront in this field.”

Tower has collaborated with Marvell to advance next-generation coherent technologies, including process capabilities, such as the integration of non-silicon materials, the 3D integration of electronics and the enablement of advanced optical packaging such as V-Grooves, which serve to extend the performance and functionality of silicon photonics platforms.

“This milestone demonstrates the strength of our collaboration,” said Dr. Radha Nagarajan, Senior Vice President and Chief Technology Officer, Optical Engineering, at Marvell. “As one of our key ecosystem partners, we look forward to continue working with the Tower team to advance next-generation coherent technologies for scale-across data center architectures, providing customers with the latest efficient, high-performance photonics technologies to power their advanced AI workloads.”

For additional information about Tower Semiconductor’s SiPho technology platform, visit here.

For additional information about Marvell, visit here.

About Tower Semiconductor

Tower Semiconductor Ltd. (NASDAQ/TASE: TSEM), the leading foundry of high-value analog semiconductor solutions, provides technology, development, and process platforms for its customers in growing markets such as consumer, industrial, automotive, mobile, infrastructure, medical and aerospace and defense. Tower Semiconductor focuses on creating a positive and sustainable impact on the world through long-term partnerships and its advanced and innovative analog technology offering, comprised of a broad range of customizable process platforms such as SiPho, SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS image sensor, non-imaging sensors, displays, integrated power management (BCD and 700V), and MEMS. Tower Semiconductor also provides world-class design enablement for a quick and accurate design cycle as well as process transfer services including development, transfer, and optimization, to IDMs and fabless companies. To provide multi-fab sourcing and extended capacity for its customers, Tower Semiconductor currently owns one operating facility in Israel (200mm), two in the U.S. (200mm), and two in Japan (200mm and 300mm) which it owns through its 51% holdings in TPSCo and shares a 300mm facility in Agrate, Italy with STMicroelectronics. For more information, please visit: www.towersemi.com.

Safe Harbor Regarding Forward-Looking Statements
This press release includes forward-looking statements, which are subject to risks and uncertainties. Actual results may vary from those projected or implied by such forward-looking statements. A complete discussion of risks and uncertainties that may affect the accuracy of forward-looking statements included in this press release or which may otherwise affect Tower’s business is included under the heading “Risk Factors” in Tower’s most recent filings on Forms 20-F, F-3, F-4 and 6-K, as were filed with the Securities and Exchange Commission (the “SEC”) and the Israel Securities Authority. Tower does not intend to update, and expressly disclaim any obligation to update, the information contained in this release. 

                                                ###
Tower Semiconductor Company Contact: Orit Shahar | +972-74-7377440 | oritsha@towersemi.com
Tower Semiconductor Investor Relations Contact: Liat Avraham | +972-4-6506154 | liatavra@towersemi.com

Attachment

• Tower_Marvell_ SiPho_PR_FINAL

FAQ

AI-generated questions and answers. How Rhea-AI works. Not financial advice.

What milestone did Tower Semiconductor (TSEM) announce with Marvell on June 18, 2026?

Tower Semiconductor and Marvell announced shipping over five million coherent photonic ICs. According to Tower, these ICs support AI-driven data center interconnect networks, addressing growing bandwidth and energy-efficiency requirements for advanced optical transceiver applications.

How do Tower Semiconductor and Marvell use coherent photonic ICs in AI data centers?

Tower and Marvell use coherent photonic ICs to enable high-bandwidth, energy-efficient AI data center interconnects. According to Tower, these complex PICs precisely control light phase and polarization, supporting advanced coherent optical transceivers for large-scale data center architectures.

What technologies power Tower Semiconductor’s silicon photonics (SiPho) platform for TSEM?

Tower’s SiPho platform includes non-silicon material integration, 3D electronic integration and advanced optical packaging. According to Tower, features like V-Groove packaging extend performance and functionality, supporting next-generation coherent photonics for high-performance data center connectivity.

Why are coherent photonic ICs important for Marvell and Tower Semiconductor (TSEM) customers?

Coherent photonic ICs enable precise control of phase and polarization, beyond simple amplitude modulation. According to Marvell and Tower, this supports efficient, high-performance optical transceivers demanded by AI workloads and modern data center interconnect networks.

How does the Tower-Marvell collaboration support next-generation coherent technologies for TSEM investors?

The collaboration focuses on advanced process capabilities and packaging for coherent photonics. According to Tower and Marvell, integrating new materials, 3D electronics and V-Grooves aims to scale coherent technologies across data center architectures serving advanced AI workloads.