Tower Semiconductor to Highlight its High-Volume Silicon Photonics and SiGe Solutions for AI Infrastructure, Telecom and Emerging Applications at ECOC 2026

Tower Semiconductor (TSEM) will showcase its silicon photonics and Silicon Germanium (SiGe) solutions at ECOC 2026, held September 21–23, 2026 at FYCMA in Malaga, Spain, booth C1014.

Rhea-AI Summary

Tower Semiconductor (TSEM) will showcase its silicon photonics and Silicon Germanium (SiGe) solutions at ECOC 2026, held September 21–23, 2026 at FYCMA in Malaga, Spain, booth C1014.

The company plans to present its high-volume, high-performance silicon photonics platform used in datacenter and telecom optical transceivers and in applications such as near- and co-packaged optics for AI clusters, DWDM lasers, optical circuit switching, FMCW LiDAR for Physical AI, and quantum computing. Tower will also feature its SiGe BiCMOS solutions, designed to complement its SiPho platform to meet higher-bandwidth, lower-latency and lower-power needs of next-generation AI infrastructure. Company representatives will be available during the event for roadmap discussions.

Key Terms

silicon photonics, bicmos, dwdm, fmcw lidar, +1 more

5 terms

silicon photonics technical

"Tower will showcase its high-volume and high-performance Silicon Photonics platform"

Silicon photonics is the technology that uses tiny structures etched into silicon chips to generate, control and detect light for moving data and sensing, essentially putting optical fiber functions onto a computer chip. For investors, it matters because it can dramatically increase data speed and energy efficiency in data centers, telecom networks and advanced sensors, potentially lowering costs and enabling new products much like replacing many metal wires with faster, low-power optical highways.

bicmos technical

"The company will also feature its Silicon Germanium (SiGe) BiCMOS solutions"

BiCMOS is a semiconductor manufacturing technology that puts two kinds of transistors—bipolar transistors (good for fast, high-current analog tasks) and CMOS transistors (good for low-power digital logic)—on the same chip. Like a hybrid car that pairs a gas engine for power with an electric motor for efficiency, BiCMOS lets devices combine high-speed analog performance with dense, energy-efficient digital circuits, which can influence product capabilities, production costs, and competitive position in markets such as communications, sensors, and power management.

dwdm technical

"DWDM lasers, optical circuit switching, FMCW LiDAR for Physical AI"

Dense Wavelength Division Multiplexing (DWDM) is an optical networking technology that lets many separate data streams travel simultaneously over a single fiber by using different colors of light, like adding lanes to a highway without laying new road. For investors, DWDM matters because it enables service providers and data centers to increase capacity, cut per‑unit transmission costs, and delay expensive fiber builds, affecting revenue potential, capital spending and competitive positioning.

fmcw lidar technical

"optical circuit switching, FMCW LiDAR for Physical AI"

Frequency-modulated continuous-wave (FMCW) LiDAR is a laser-based sensing system that measures both distance and speed by sending a continuously changing-frequency beam and comparing the returned light, similar to how a police radar tunes and listens for a reflected signal. It matters to investors because FMCW designs can deliver longer range, more reliable readings in traffic or crowded environments, lower interference and better velocity data than older pulsed LiDAR, which can translate into stronger product performance, safety advantages and clearer market differentiation for companies using or supplying the technology.

co-packaged optics technical

"near- and co-packaged optics (NPO/CPO) for next-generation AI cluster architectures"

Co-packaged optics are optical components—lasers and fiber interfaces—physically packaged together with a network switch’s main processing chip so light-based data links sit much closer to the chip instead of traveling over long electrical traces. For investors, this matters because it can dramatically cut power use, boost data speed and density, and lower system costs in large data centers and telecom equipment, much like moving a power outlet next to a heavy appliance to avoid long, inefficient extension cords.

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MIGDAL HAEMEK, Israel, September 15, 2026 – Tower Semiconductor (NASDAQ/TASE: TSEM), the leading foundry for high-value analog semiconductor solutions, today announced its participation in upcoming ECOC 2026, taking place September 21–23, 2026 at FYCMA, Malaga, Spain, booth #C1014. During the event days, company representatives will be available for meetings to discuss current and future silicon photonics roadmap.

Tower will showcase its high-volume and high-performance Silicon Photonics platform, widely utilized across the industry for datacenter and telecom optical transceivers, as well as for high-growth applications, including near- and co-packaged optics (NPO/CPO) for next-generation AI cluster architectures, DWDM lasers, optical circuit switching, FMCW LiDAR for Physical AI, and quantum computing. The company will also feature its Silicon Germanium (SiGe) BiCMOS solutions, which complement its SiPho platform to address the higher-bandwidth, lower-latency and lower-power demands of next-generation AI infrastructure.

To learn more about Tower’s advanced silicon photonics (SiPho) platform and RF & HPA technology offerings, visit here.

About Tower Semiconductor

Tower Semiconductor Ltd. (NASDAQ/TASE: TSEM), the leading foundry of high-value analog semiconductor solutions, provides technology, development, and process platforms for its customers in growing markets such as consumer, industrial, automotive, mobile, infrastructure, medical and aerospace and defense. Tower Semiconductor focuses on creating a positive and sustainable impact on the world through long-term partnerships and its advanced and innovative analog technology offering, comprised of a broad range of customizable process platforms such as SiPho, SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS image sensor, non-imaging sensors, displays, and integrated power management (BCD and 700V). Tower Semiconductor also provides world-class design enablement for a quick and accurate design cycle as well as process transfer services including development, transfer, and optimization, to IDMs and fabless companies. To provide multi-fab sourcing and extended capacity for its customers, Tower Semiconductor currently owns one operating facility in Israel (200mm), two in the U.S. (200mm), and two in Japan (200mm and 300mm) which it owns through its 51% holdings in TPSCo and shares a 300mm facility in Agrate, Italy with STMicroelectronics. For more information, please visit: www.towersemi.com.

Safe Harbor Regarding Forward-Looking Statements
This press release includes forward-looking statements, which are subject to risks and uncertainties. Actual results may vary from those projected or implied by such forward-looking statements. A complete discussion of risks and uncertainties that may affect the accuracy of forward-looking statements included in this press release or which may otherwise affect Tower’s business is included under the heading “Risk Factors” in Tower’s most recent filings on Forms 20-F, F-3, F-4 and 6-K, as were filed with the Securities and Exchange Commission (the “SEC”) and the Israel Securities Authority. Tower does not intend to update, and expressly disclaim any obligation to update, the information contained in this release. 

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Tower Semiconductor Company Contact: Orit Shahar | +972-74-7377440 | oritsha@towersemi.com
Tower Semiconductor Investor Relations Contact: Liat Avraham | +972-4-6506154 | liatavra@towersemi.com

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