Tower Semi to showcase silicon photonics at ECOC 2026

Tower Semiconductor Ltd. (TSEM) reported that it will participate in ECOC 2026 in Malaga, Spain on September 21–23, 2026, where it will highlight its high-volume silicon photonics and SiGe solutions.

Rhea-AI Filing Summary

Tower Semiconductor Ltd. (TSEM) reported that it will participate in ECOC 2026 in Malaga, Spain on September 21–23, 2026, where it will highlight its high-volume silicon photonics and SiGe solutions. Company representatives will be available for meetings to discuss its current and future silicon photonics roadmap.

Tower plans to showcase its Silicon Photonics platform, used for datacenter and telecom optical transceivers and applications such as NPO/CPO for next-generation AI cluster architectures, DWDM lasers, optical circuit switching, FMCW LiDAR for Physical AI, and quantum computing. It will also feature its Silicon Germanium (SiGe) BiCMOS solutions aimed at higher-bandwidth, lower-latency and lower-power demands of next-generation AI infrastructure.

Key Figures

ECOC 2026 dates: September 21–23, 2026 ECOC 2026 booth: Booth #C1014 Ownership in TPSCo: 51% +3 more

6 metrics

ECOC 2026 dates September 21–23, 2026 Dates of Tower Semiconductor’s participation at ECOC 2026 in Malaga, Spain

ECOC 2026 booth Booth #C1014 Location of Tower Semiconductor’s exhibit at ECOC 2026

Ownership in TPSCo 51% Tower Semiconductor’s reported holding in TPSCo for its Japan fabs

Wafer size Israel facility 200mm Diameter of wafers produced at Tower’s operating facility in Israel

Wafer sizes Japan facilities 200mm and 300mm Diameters of wafers at Tower’s Japan facilities owned through TPSCo

Form type Form 6-K Report of foreign private issuer for the month of September 2026

Key Terms

Silicon Photonics, SiGe BiCMOS, near- and co-packaged optics (NPO/CPO), FMCW LiDAR, +2 more

6 terms

Silicon Photonics technical

"Tower will showcase its high-volume and high-performance Silicon Photonics platform"

Silicon photonics is the technology that uses tiny structures etched into silicon chips to generate, control and detect light for moving data and sensing, essentially putting optical fiber functions onto a computer chip. For investors, it matters because it can dramatically increase data speed and energy efficiency in data centers, telecom networks and advanced sensors, potentially lowering costs and enabling new products much like replacing many metal wires with faster, low-power optical highways.

SiGe BiCMOS technical

"The company will also feature its Silicon Germanium (SiGe) BiCMOS solutions"

near- and co-packaged optics (NPO/CPO) technical

"including near- and co-packaged optics (NPO/CPO) for next-generation AI cluster"

FMCW LiDAR technical

"FMCW LiDAR for Physical AI, and quantum computing"

Frequency-modulated continuous-wave (FMCW) LiDAR is a laser-based sensing system that measures both distance and speed by sending a continuously changing-frequency beam and comparing the returned light, similar to how a police radar tunes and listens for a reflected signal. It matters to investors because FMCW designs can deliver longer range, more reliable readings in traffic or crowded environments, lower interference and better velocity data than older pulsed LiDAR, which can translate into stronger product performance, safety advantages and clearer market differentiation for companies using or supplying the technology.

Physical AI technical

"FMCW LiDAR for Physical AI, and quantum computing"

Physical AI combines artificial intelligence with physical devices or environments, enabling machines to interact with and adapt to the real world in a human-like way. It matters to investors because it can lead to smarter robots, autonomous vehicles, or advanced sensors that improve efficiency and open new markets, potentially creating significant business opportunities and competitive advantages.

forward-looking statements regulatory

"This press release includes forward-looking statements, which are subject to risks"

Forward-looking statements are predictions or plans that companies share about what they expect to happen in the future, like estimating sales or profits. They matter because they help investors understand a company's outlook, but since they are based on guesses and assumptions, they can sometimes be wrong.

FAQ

AI-generated questions and answers. How Rhea-AI works. Not financial advice.

What did TSEM announce in this Form 6-K for September 2026?

Tower Semiconductor announced its participation in ECOC 2026 in Malaga, Spain, where it will highlight its high-volume Silicon Photonics platform and SiGe BiCMOS solutions for AI infrastructure, telecom, and emerging applications.

When and where will Tower Semiconductor (TSEM) appear at ECOC 2026?

Tower Semiconductor plans to participate in ECOC 2026 from September 21–23, 2026 at FYCMA in Malaga, Spain, exhibiting at booth #C1014.

What technologies will TSEM showcase at ECOC 2026?

Tower will showcase its high-volume Silicon Photonics platform for datacenter and telecom optical transceivers and applications such as NPO/CPO for AI clusters, DWDM lasers, optical circuit switching, FMCW LiDAR for Physical AI, and quantum computing, plus its SiGe BiCMOS solutions.

How do Tower Semiconductor’s SiGe BiCMOS solutions relate to AI infrastructure?

The company states its Silicon Germanium (SiGe) BiCMOS solutions complement its Silicon Photonics platform to address the higher-bandwidth, lower-latency and lower-power requirements of next-generation AI infrastructure.

What markets does Tower Semiconductor (TSEM) target with its analog semiconductor platforms?

Tower Semiconductor reports serving consumer, industrial, automotive, mobile, infrastructure, medical, and aerospace and defense markets with analog technology platforms such as SiPho, SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS image sensors, non-imaging sensors, displays, and integrated power management.

How many manufacturing facilities does Tower Semiconductor currently operate or share?

Tower Semiconductor states it owns one 200mm facility in Israel, two 200mm facilities in the U.S., and two facilities in Japan (200mm and 300mm) through its 51% holding in TPSCo, and it shares a 300mm facility in Agrate, Italy with STMicroelectronics.

AI-generated analysis. How Rhea-AI works. Not financial advice.

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Available on EDGAR 09/15/2026 - 06:06 AM EDT Accepted by SEC EDGAR 09/15/2026 - 06:01 AM EDT Learn about SEC filing dates

UNITED STATES

SECURITIES AND EXCHANGE COMMISSION

Washington, D.C. 20549

FORM 6-K

REPORT OF FOREIGN PRIVATE ISSUER PURSUANT TO RULE 13a-16 OR 15d-16

OF THE SECURITIES EXCHANGE ACT OF 1934

For the month of September 2026 No.1

Commission File Number 0-24790

TOWER SEMICONDUCTOR LTD.

(Translation of registrant's name into English)

Ramat Gavriel Industrial Park

P.O. Box 619, Migdal Haemek, Israel 2310502

(Address of principal executive offices)

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.

Form 20-F ☒           Form 40-F ☐

On September 15, 2026, the Registrant to Highlight its High-Volume

Silicon Photonics and SiGe Solutions for AI Infrastructure, Telecom and

Emerging Applications at ECOC 2026

SIGNATURES

Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

	TOWER SEMICONDUCTOR LTD.
Date: September 15, 2026	By:	/s/ Nati Somekh
	Name: Title:	Nati Somekh Corporate Secretary

 

Tower Semiconductor to Highlight its High-Volume Silicon Photonics and SiGe Solutions for AI Infrastructure, Telecom and Emerging Applications at ECOC 2026

MIGDAL HAEMEK, Israel, September 15, 2026 – Tower Semiconductor (NASDAQ/TASE: TSEM), the leading foundry for high-value analog semiconductor solutions, today announced its participation in upcoming ECOC 2026, taking place September 21–23, 2026 at FYCMA, Malaga, Spain, booth #C1014. During the event days, company representatives will be available for meetings to discuss current and future silicon photonics roadmap.

Tower will showcase its high-volume and high-performance Silicon Photonics platform, widely utilized across the industry for datacenter and telecom optical transceivers, as well as for high-growth applications, including near- and co-packaged optics (NPO/CPO) for next-generation AI cluster architectures, DWDM lasers, optical circuit switching, FMCW LiDAR for Physical AI, and quantum computing. The company will also feature its Silicon Germanium (SiGe) BiCMOS solutions, which complement its SiPho platform to address the higher-bandwidth, lower-latency and lower-power demands of next-generation AI infrastructure.

To learn more about Tower’s advanced silicon photonics (SiPho) platform and RF & HPA technology offerings, visit here.

About Tower Semiconductor

Tower Semiconductor Ltd. (NASDAQ/TASE: TSEM), the leading foundry of high-value analog semiconductor solutions, provides technology, development, and process platforms for its customers in growing markets such as consumer, industrial, automotive, mobile, infrastructure, medical and aerospace and defense. Tower Semiconductor focuses on creating a positive and sustainable impact on the world through long-term partnerships and its advanced and innovative analog technology offering, comprised of a broad range of customizable process platforms such as SiPho, SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS image sensor, non-imaging sensors, displays, and integrated power management (BCD and 700V). Tower Semiconductor also provides world-class design enablement for a quick and accurate design cycle as well as process transfer services including development, transfer, and optimization, to IDMs and fabless companies. To provide multi-fab sourcing and extended capacity for its customers, Tower Semiconductor currently owns one operating facility in Israel (200mm), two in the U.S. (200mm), and two in Japan (200mm and 300mm) which it owns through its 51% holdings in TPSCo and shares a 300mm facility in Agrate, Italy with STMicroelectronics. For more information, please visit: www.towersemi.com.

Safe Harbor Regarding Forward-Looking Statements

This press release includes forward-looking statements, which are subject to risks and uncertainties. Actual results may vary from those projected or implied by such forward-looking statements. A complete discussion of risks and uncertainties that may affect the accuracy of forward-looking statements included in this press release or which may otherwise affect Tower’s business is included under the heading “Risk Factors” in Tower’s most recent filings on Forms 20-F, F-3, F-4 and 6-K, as were filed with the Securities and Exchange Commission (the “SEC”) and the Israel Securities Authority. Tower does not intend to update, and expressly disclaim any obligation to update, the information contained in this release. 

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Tower Semiconductor Company Contact: Orit Shahar | +972-74-7377440 | oritsha@towersemi.com

Tower Semiconductor Investor Relations Contact: Liat Avraham | +972-4-6506154 | liatavra@towersemi.com