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OpenLight and Tower Semiconductor Expand PH18DA Photonics Ecosystem to Accelerate Photonic IC Development

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Tower Semiconductor (NASDAQ/TASE: TSEM) and OpenLight announced that OpenLight’s photonic Process Design Kit (PDK) for Tower’s PH18DA indium phosphide (InP)-on-silicon photonics platform is now available within Cadence electronic design automation (EDA) tools. The jointly developed PDK lets customers design photonic integrated circuits (PICs) in a familiar IC design environment and move more efficiently toward production.

The PH18DA ecosystem now combines OpenLight’s photonics IP, Tower’s process and manufacturing capabilities, and Cadence’s EDA environment to support monolithic PICs integrating active components such as lasers, modulators, and amplifiers. According to Tower Semiconductor, this enables development of 400G and 1.6T laser-integrated PICs and co-optimized photonic and electronic ICs for next-generation near- and co-packaged optics, targeting applications including optical interconnects, AI infrastructure, and sensing. OpenLight also highlights a recent $50 million Series A-1 funding round, bringing its total funding to $84 million.

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Positive

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Negative

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Market Context

TSEM’s prior quarterly-results announcement produced a 2.22% 24-hour reaction, providing a market-hi...
Analysis

TSEM’s prior quarterly-results announcement produced a 2.22% 24-hour reaction, providing a market-history anchor for this ecosystem update. Low short positioning reduces one volatility concern, while recent insider net selling remains a risk factor to monitor.

Key Figures

Target data rates: 400G and 1.6T Series A-1 funding: $50 million Total funding: $84 million +4 more
7 metrics
Target data rates 400G and 1.6T Laser-integrated photonic integrated circuits
Series A-1 funding $50 million OpenLight recent funding round
Total funding $84 million OpenLight total funding after Series A-1
TPSCo ownership 51% Tower ownership of TPSCo
200mm facilities one in Israel and two in the U.S. Tower-owned operating facilities
Japan facilities two facilities Tower ownership through 51% holdings in TPSCo
300mm facilities one in Japan and one shared in Italy Tower manufacturing footprint

Historical Context

5 past events · Latest: Aug 04 (Positive)
Pattern 5 events
Date Event Sentiment 24h Move Catalyst
Aug 04 2Q26 results Positive +2.2% Record Q2 revenue and profit plus Q3 revenue guidance drove a gain.
Jul 14 Capacity expansion Positive +11.2% Japan expansion included approximately $1 billion in grants and about $3 billion of investment.
Jul 07 Earnings scheduling Neutral -3.2% Announcement scheduled Q2 results and guidance call; shares subsequently declined 3.21%.
Jul 01 Leveraged ETF launch Neutral -5.8% Launch of 2X long single-stock ETFs including TSEM preceded a 5.82% decline.
Jun 26 Leveraged ETF plan Neutral -7.4% Planned leveraged ETF launch for TSEM preceded a 7.4% decline in shares.

24h Move is the share-price change in the day after each event; other market factors may also have contributed.

Pattern Detected

Positive operational and capacity announcements aligned with gains, while scheduling and leveraged-ETF-related news coincided with declines.

Key Terms

inp-on-silicon, co-packaged optics
2 terms
inp-on-silicon technical
"Tower Semiconductor’s PH18DA indium phosphide (InP)-on-silicon photonics platform"
InP-on-silicon is a chip-making approach that bonds or grows tiny pieces of indium phosphide (a material used to make lasers and other light components) onto standard silicon wafers so optical functions can be built directly alongside ordinary electronic circuits. For investors, it matters because it promises to combine the performance of specialized optical chips with the lower cost and high-volume manufacturing of silicon, potentially lowering production costs and enabling new, faster networking and data-center products.
co-packaged optics technical
"next-generation near- and co-packaged optics (NPO/CPO) solutions"
Co-packaged optics are optical components—lasers and fiber interfaces—physically packaged together with a network switch’s main processing chip so light-based data links sit much closer to the chip instead of traveling over long electrical traces. For investors, this matters because it can dramatically cut power use, boost data speed and density, and lower system costs in large data centers and telecom equipment, much like moving a power outlet next to a heavy appliance to avoid long, inefficient extension cords.

AI-generated analysis. How Rhea-AI works. Not financial advice.

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OpenLight’s PDK is now available on Cadence’s EDA tools, enabling PIC development on Tower’s PH18DA InP-on-silicon photonics platform

SANTA BARBARA, Calif., and MIGDAL HAEMEK, Israel, - August 11, 2026 - OpenLight, a leader in heterogeneous III-V-on-silicon photonic integration and custom Photonic Application-Specific Integrated Circuits (PASICs),  and Tower Semiconductor (NASDAQ/TASE: TSEM), the leading foundry for high-value analog semiconductor solutions, today announced the availability of OpenLight’s photonic Process Design Kit (PDK) for Tower Semiconductor’s PH18DA indium phosphide (InP)-on-silicon photonics platform in Cadence’s electronic design automation (EDA) tools. Developed through close technical collaboration between the companies, the PDK now enables customers to design advanced photonic integrated circuits (PICs) within a widely adopted IC design environment and accelerate development toward production.

The PH18DA ecosystem brings together OpenLight’s photonics IP, Tower’s process and manufacturing expertise, and Cadence’s leading EDA tools, enabling a streamlined path for developing advanced photonic ICs while bringing photonics design closer to established electronic IC workflows and manufacturing.

“By making our PDK available on Cadence tools, we enable customers to design photonic integrated circuits within the same environment they rely on for advanced IC development,” said Dr. Adam Carter, CEO at OpenLight. “This integration simplifies adoption and strengthens the path from design to production on the PH18DA platform.”

Designs created using OpenLight‘s PDK support fabrication on Tower’s PH18DA InP-on-silicon photonics platform, which enables the integration of active photonic components - including lasers, modulators, and amplifiers - into a single monolithic PIC. The platform supports advanced optical systems for applications such as optical interconnects, AI infrastructure, and sensing.

“In collaboration with Cadence and OpenLight, we are advancing design capabilities on the PH18DA platform through a new capability that integrates expertise across technology, IP, and EDA,” said Dr. Samir Chaudhry, Vice President of Customer Design Enablement and Reliability at Tower Semiconductor. “This approach enables customers to streamline development of 400G and 1.6T laser-integrated photonic integrated circuits, while achieving co-optimized PIC and EIC designs for improved performance, power efficiency, and scalability necessary for next-generation near- and co-packaged optics (NPO/CPO) solutions.”

"Adding the OpenLight PDK PH18DA manufactured by Tower Semiconductor to the rich portfolio of photonics processes supported by the Cadence Photonics ecosystem is a key milestone because it marks the introduction of integrated active devices for high-performance, co-optimized electro-optical designs," said Gilles Lamant, Distinguished Engineer, Cadence.

For additional information about Tower Semiconductor’s SiPho technology platform, visit here.

For additional information about OpenLight, visit here.

About OpenLight
OpenLight is a leader in the heterogeneous integration of III-V devices in silicon photonics. OpenLight’s world-leading PASIC technology, supported by its process design kit (PDK), integrates all active and passive components of silicon photonics devices into a single chip, enabling high-performance, energy-efficient photonics solutions across datacom, telecom, automotive, AI, and quantum computing applications and markets. The company’s recent $50 million Series A-1 funding round, bringing total funding to $84 million, reflects growing commercial momentum and accelerating customer adoption across next-generation photonics applications. The company is headquartered in Santa Barbara, California, with offices in Silicon Valley. Read more at www.openlightphotonics.com.

About Tower Semiconductor

Tower Semiconductor Ltd. (NASDAQ/TASE: TSEM), the leading foundry of high-value analog semiconductor solutions, provides technology, development, and process platforms for its customers in growing markets such as consumer, industrial, automotive, mobile, infrastructure, medical and aerospace and defense. Tower Semiconductor focuses on creating a positive and sustainable impact on the world through long-term partnerships and its advanced and innovative analog technology offering, comprised of a broad range of customizable process platforms such as SiPho, SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS image sensor, non-imaging sensors, displays, integrated power management (BCD and 700V), and MEMS. Tower Semiconductor also provides world-class design enablement for a quick and accurate design cycle as well as process transfer services including development, transfer, and optimization, to IDMs and fabless companies. To provide multi-fab sourcing and extended capacity for its customers, Tower Semiconductor currently owns one operating facility in Israel (200mm), two in the U.S. (200mm), and two in Japan (200mm and 300mm) which it owns through its 51% holdings in TPSCo and shares a 300mm facility in Agrate, Italy with STMicroelectronics. For more information, please visit: www.towersemi.com.

Safe Harbor Regarding Forward-Looking Statements
This press release includes forward-looking statements, which are subject to risks and uncertainties. Actual results may vary from those projected or implied by such forward-looking statements. A complete discussion of risks and uncertainties that may affect the accuracy of forward-looking statements included in this press release or which may otherwise affect Tower’s business is included under the heading “Risk Factors” in Tower’s most recent filings on Forms 20-F, F-3, F-4 and 6-K, as were filed with the Securities and Exchange Commission (the “SEC”) and the Israel Securities Authority. Tower does not intend to update, and expressly disclaim any obligation to update, the information contained in this release. 

                                                ###
Tower Semiconductor Company Contact: Orit Shahar | +972-74-7377440 | oritsha@towersemi.com
Tower Semiconductor Investor Relations Contact: Liat Avraham | +972-4-6506154 | liatavra@towersemi.com

OpenLight Photonics Company Contact: Mallory Robertson mallory@grandbridges.com

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FAQ

What did Tower Semiconductor (TSEM) and OpenLight announce on August 11, 2026?

Tower Semiconductor and OpenLight announced the availability of OpenLight’s photonic PDK for Tower’s PH18DA InP-on-silicon photonics platform in Cadence EDA tools. According to both companies, this lets customers design advanced photonic integrated circuits within a widely used IC design environment and streamline progression toward production.

What is Tower Semiconductor’s PH18DA InP-on-silicon photonics platform for TSEM investors?

PH18DA is Tower Semiconductor’s InP-on-silicon photonics platform that supports monolithic integration of active photonic components, including lasers, modulators, and amplifiers, into a single PIC. According to Tower Semiconductor, it targets advanced optical systems for optical interconnects, AI infrastructure, sensing, and next-generation near- and co-packaged optics solutions.

How does the OpenLight PDK integration with Cadence tools benefit Tower Semiconductor (TSEM) customers?

The integration allows customers to design photonic integrated circuits for Tower’s PH18DA platform directly in Cadence EDA tools. According to Tower Semiconductor, this supports streamlined development of 400G and 1.6T laser-integrated PICs and enables co-optimized photonic and electronic IC designs for improved performance, power efficiency, and scalability.

What applications are targeted by the PH18DA photonics ecosystem with OpenLight’s PDK for TSEM?

The PH18DA ecosystem targets advanced optical systems such as optical interconnects, AI infrastructure, and sensing applications. According to Tower Semiconductor and OpenLight, it also addresses next-generation near- and co-packaged optics (NPO/CPO) solutions using laser-integrated photonic integrated circuits with co-optimized electronic and photonic design flows.

How is OpenLight funded and what does this mean for its collaboration with Tower Semiconductor (TSEM)?

OpenLight recently completed a $50 million Series A-1 funding round, bringing total funding to $84 million. According to OpenLight, this reflects growing commercial momentum and customer adoption of its PASIC and PDK technology, supporting continued development within ecosystems like Tower Semiconductor’s PH18DA photonics platform.

What role does Cadence play in the Tower Semiconductor (TSEM) and OpenLight PH18DA photonics ecosystem?

Cadence provides the EDA environment in which OpenLight’s PDK for Tower’s PH18DA platform is now available. According to Cadence, adding the OpenLight PH18DA PDK introduces integrated active devices for high-performance, co-optimized electro-optical designs within the broader Cadence Photonics ecosystem.