Tower Semiconductor Extends its Leadership in BCD Performance with New Gen3 LDMOS Technology Addressing the ‘AI Power Wall’

Tower Semiconductor (NASDAQ/TASE: TSEM) released its Gen3 BCD LDMOS power management platform to address rising AI data center power demands and high-current applications.

Rhea-AI Summary

Tower Semiconductor (NASDAQ/TASE: TSEM) released its Gen3 BCD LDMOS power management platform to address rising AI data center power demands and high-current applications. The platform targets higher efficiency, lower heat, and die-size reduction for power management ICs, and targets Monolithic Smart Power Stage/DrMOS markets.

Tower will present these developments at APEC 2026 March 23–25 in San Antonio (booth #1455); a presentation by Dr. Mete Erturk is scheduled March 24, 3:45–4:15 PM at Expo Theater 3.

Positive

• Targets Monolithic Smart Power Stage/DrMOS market estimated at $2.5B, growing to $4.7B by 2031
• Gen3 LDMOS designed for higher efficiency and reduced heat in AI processor power delivery
• Expands role in AI infrastructure by combining silicon photonics and advanced power management

Negative

• None.

Argus Mar 17 session

-0.44% close to close Open Argus

Details

News Market Reaction – TSEM

On Mar 17, the day this news came out, TSEM closed 0.44% below the previous close.

Data tracked by StockTitan Argus for the Mar 17 session.

Key Figures

Target market size: $2.5 billion Projected market size: >$4.7 billion APEC 2026 dates: March 23–25, 2026 +1 more

Target market size

$2.5 billion

Monolithic Smart Power Stage and DrMOS market, current estimate (Mordor Intelligence)

Projected market size

>$4.7 billion

Monolithic Smart Power Stage and DrMOS market by 2031 (Mordor Intelligence)

APEC 2026 dates

March 23–25, 2026

Event where Tower will present power management platform

Presentation time

3:45 PM–4:15 PM

APEC 2026 talk on power management technologies

Previous AI Reports

5 past events · Latest: Mar 04

Same Type 5 events

1. Mar 04

   Conference participation

   24h Move

   -1.6%

   OFC 2026 participation highlighting silicon photonics roadmap and AI applications.

2. Feb 17

   AI laser launch

   24h Move

   -0.8%

   First heterogeneously integrated DWDM lasers for AI infrastructure with Scintil.

3. Feb 05

   NVIDIA collaboration

   24h Move

   +6.4%

   Collaboration with NVIDIA on 1.6T data‑center optical modules for AI infrastructure.

4. Nov 17

   AI power systems

   24h Move

   -3.9%

   SW2001 buck regulator on Tower’s 65nm BCD platform targeting AI/server power.

5. Aug 25

   Laser platform debut

   24h Move

   +5.2%

   First on‑chip multi‑wavelength laser platform for AI datacenter fabrics.

24h Move is the share-price change in the day after each event; other market factors may also have contributed.

Key Terms

ldmos, pmic, monolithic smart power stage, drmos, +1 more

5 terms

ldmos technical

"Gen3 power management platform, delivering industry-leading LDMOS performance for high-current"

A laterally diffused metal-oxide-semiconductor (LDMOS) is a type of transistor used to amplify or switch high-power radio-frequency signals, commonly found in wireless base stations, broadcast transmitters and power amplifiers. Investors care because LDMOS chips are key components in infrastructure that supports mobile networks and communications equipment; strong demand, supply constraints or design wins for these parts can directly affect a maker’s sales, margins and competitive position, much like a critical engine part determines a car’s performance.

pmic technical

"as well as advanced mobile PMIC and charger applications. Tower will participate"

A PMIC is a small integrated circuit that controls how power is distributed and used inside electronic devices, like a building’s electrical panel for a smartphone or laptop. It coordinates battery charging, voltage levels and power-saving modes to improve battery life, reduce heat and protect components. For investors, a better PMIC can make a product more competitive, lower manufacturing costs or reduce return rates, all of which can affect profit and market position.

monolithic smart power stage technical

"technology specifically targets Monolithic Smart Power Stage and DrMOS applications, a market"

A monolithic smart power stage is an all-in-one semiconductor chip that combines the power switches, control circuitry and safety/monitoring features used to move and regulate electricity inside electronic devices. Like a compact kitchen appliance that replaces several separate tools, it saves board space, reduces manufacturing cost, improves reliability and can increase energy efficiency — factors that can lower product costs and affect margins, product design choices and supply-chain value for investors.

drmos technical

"technology specifically targets Monolithic Smart Power Stage and DrMOS applications, a market"

An integrated power stage that combines the transistor switches (MOSFETs) and their control circuitry into a single small package, used to convert and regulate voltage for processors and other chips. For investors it matters because DrMOS units affect a device’s power efficiency, heat output, and board space, which influence product performance, cost and demand in markets for computers, servers and mobile devices—similar to how a car’s transmission affects fuel use and performance.

silicon photonics technical

"By combining its established silicon photonics leadership in AI data centers with"

Silicon photonics is the technology that uses tiny structures etched into silicon chips to generate, control and detect light for moving data and sensing, essentially putting optical fiber functions onto a computer chip. For investors, it matters because it can dramatically increase data speed and energy efficiency in data centers, telecom networks and advanced sensors, potentially lowering costs and enabling new products much like replacing many metal wires with faster, low-power optical highways.

AI-generated analysis. How Rhea-AI works. Not financial advice.

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Company will participate and present at APEC 2026, highlighting recent advancements in its power management platform for AI processor power delivery and emerging high-current applications

MIGDAL HAEMEK, Israel, March 17, 2026 - Tower Semiconductor (NASDAQ/TASE: TSEM), the leading foundry for high-value analog semiconductor solutions, today announced the release of its latest generation BCD technology, part of its Gen3 power management platform, delivering industry-leading LDMOS performance for high-current applications. The new platform is designed to address the rapidly increasing power demands of AI data centers as well as advanced mobile PMIC and charger applications. Tower will participate and present at APEC 2026, taking place March 23–25, 2026, at the Henry B. Gonzalez Convention Center in San Antonio, TX, booth #1455.

AI infrastructure is experiencing an unprecedented increase in power consumption. As processor performance scales, power delivery efficiency has become a critical bottleneck, widely referred to as the “AI power wall.” Tower’s Gen3 LDMOS technology directly addresses this challenge by enabling higher efficiency power delivery, reducing heat generation, and improving overall system performance. The platform also leads to substantial die size reduction for power management chips with large power transistor content.

The technology specifically targets Monolithic Smart Power Stage and DrMOS applications, a market currently estimated at approximately $2.5 billion and projected to grow to more than $4.7 billion by 2031 according to Mordor Intelligence. The newly released technology includes a family of power devices specifically developed to support the demands of both lateral and vertical power delivery for AI processors, such as ultra-low switching and conduction losses. By combining its established silicon photonics leadership in AI data centers with advanced power management capabilities, Tower is expanding its role in AI infrastructure from optical interconnect to efficient AI processor power delivery.

APEC 2026 Event Details
Tower Semiconductor representatives will be available to meet with existing and prospective customers throughout the event dates.
Dates: March 23–25, 2026
Venue: Henry B. Gonzalez Convention Center, San Antonio, TX
Booth: #1455

Presentation Details
Title: Tower’s Power Management Technologies: Achieving Highest System Efficiency & Integration
By Dr. Mete Erturk, Co-General Manager, Power Management BU
Date: March 24, 2026
Time: 3:45 PM – 4:15 PM
Location: Expo Theater 3

To learn more about Tower’s advanced power management platform offerings, visit here.

About Tower Semiconductor
Tower Semiconductor Ltd. (NASDAQ/TASE: TSEM), the leading foundry of high-value analog semiconductor solutions, provides technology, development, and process platforms for its customers in growing markets such as consumer, industrial, automotive, mobile, infrastructure, medical and aerospace and defense. Tower Semiconductor focuses on creating a positive and sustainable impact on the world through long-term partnerships and its advanced and innovative analog technology offering, comprised of a broad range of customizable process platforms such as SiPho, SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS image sensor, non-imaging sensors, displays, integrated power management (BCD and 700V), and MEMS. Tower Semiconductor also provides world-class design enablement for a quick and accurate design cycle as well as process transfer services including development, transfer, and optimization, to IDMs and fabless companies. To provide multi-fab sourcing and extended capacity for its customers, Tower Semiconductor currently owns one operating facility in Israel (200mm), two in the U.S. (200mm), and two in Japan (200mm and 300mm) which it owns through its 51% holdings in TPSCo and shares a 300mm facility in Agrate, Italy with STMicroelectronics. For more information, please visit: www.towersemi.com.

Safe Harbor Regarding Forward-Looking Statements
This press release includes forward-looking statements, which are subject to risks and uncertainties. Actual results may vary from those projected or implied by such forward-looking statements. A complete discussion of risks and uncertainties that may affect the accuracy of forward-looking statements included in this press release or which may otherwise affect Tower’s business is included under the heading “Risk Factors” in Tower’s most recent filings on Forms 20-F, F-3, F-4 and 6-K, as were filed with the Securities and Exchange Commission (the “SEC”) and the Israel Securities Authority. Tower does not intend to update, and expressly disclaim any obligation to update, the information contained in this release. 

Tower Semiconductor Company Contact: Orit Shahar | +972-74-7377440 | oritsha@towersemi.com
Tower Semiconductor Investor Relations Contact: Liat Avraham | +972-4-6506154 | liatavra@towersemi.com

Attachment

• APEC_2026_Gen3_ PR_FINAL

FAQ

AI-generated questions and answers. How Rhea-AI works. Not financial advice.

What is Tower Semiconductor (TSEM) announcing about Gen3 LDMOS on March 17, 2026?

Tower announced a Gen3 BCD LDMOS power management platform designed for higher-efficiency, lower-heat power delivery. According to the company, the technology targets high-current AI processor delivery and advanced mobile PMIC and charger applications.

How does Tower claim Gen3 LDMOS addresses the 'AI power wall' for TSEM?

Gen3 LDMOS is said to enable higher efficiency power delivery and reduced heat generation. According to the company, this improves system performance and helps mitigate power-delivery bottlenecks in AI data centers.

Which market does Tower say Gen3 targets and what is its size for TSEM investors?

The technology specifically targets Monolithic Smart Power Stage and DrMOS applications, a market estimated at $2.5B today. According to the company, that market is projected to grow to over $4.7B by 2031 per Mordor Intelligence.

When and where will Tower Semiconductor (TSEM) present Gen3 LDMOS at APEC 2026?

Tower will present at APEC 2026, March 23–25 in San Antonio, booth #1455. According to the company, Dr. Mete Erturk will present March 24, 3:45–4:15 PM at Expo Theater 3.

What practical benefits does Tower say Gen3 LDMOS offers to power management ICs for TSEM shareholders?

The company says the platform enables ultra-low switching and conduction losses and substantial die-size reduction for chips with large power transistor content. According to the company, this supports high-current AI and advanced mobile power applications.