Tower Semiconductor to Participate at OFC 2026 Highlighting its Silicon Photonics Platform for AI, Telecom and Emerging Applications

Tower Semiconductor (NASDAQ/TASE: TSEM) will participate in OFC 2026 March 17–19, 2026 at the Los Angeles Convention Center, booth #2221.

Rhea-AI Summary

Tower Semiconductor (NASDAQ/TASE: TSEM) will participate in OFC 2026 March 17–19, 2026 at the Los Angeles Convention Center, booth #2221.

Company representatives will discuss its Silicon Photonics (SiPho) roadmap and showcase SiPho and SiGe BiCMOS solutions for telecom, co‑packaged optics, DWDM lasers, FMCW LiDAR and quantum computing. A partner demo schedule will be posted on the company events webpage.

Argus Mar 4 session

-1.62% close to close Open Argus

Details

News Market Reaction – TSEM

On Mar 4, the day this news came out, TSEM closed 1.62% below the previous close.

Data tracked by StockTitan Argus for the Mar 4 session.

Key Figures

OFC 2026 dates: March 17–19, 2026 Booth number: #2221 Q4 2025 revenue: $440 million +3 more

OFC 2026 dates

March 17–19, 2026

OFC 2026 conference schedule in Los Angeles

Booth number

#2221

Tower’s booth location at OFC 2026

Q4 2025 revenue

$440 million

Record quarterly revenue reported in 6-K on Feb 11, 2026

FY 2025 revenue

$1.57 billion

Full-year 2025 revenue from 6-K financial report

Q4 2025 net profit

$80 million

Fourth quarter 2025 net profit in 6-K

SiPho/SiGe CapEx

$920 million

Total capital investments for SiPho and SiGe capacity expansion

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Key Terms

silicon photonics, co-packaged optics, fmcw lidars, silicon germanium bicmos

4 terms

silicon photonics technical

"The company will showcase its popular Silicon Photonics platform that has been the top choice..."

Silicon photonics is the technology that uses tiny structures etched into silicon chips to generate, control and detect light for moving data and sensing, essentially putting optical fiber functions onto a computer chip. For investors, it matters because it can dramatically increase data speed and energy efficiency in data centers, telecom networks and advanced sensors, potentially lowering costs and enabling new products much like replacing many metal wires with faster, low-power optical highways.

co-packaged optics technical

"...applications such as co-packaged optics (CPO) for Scale-Up architecture, DWDM lasers..."

Co-packaged optics are optical components—lasers and fiber interfaces—physically packaged together with a network switch’s main processing chip so light-based data links sit much closer to the chip instead of traveling over long electrical traces. For investors, this matters because it can dramatically cut power use, boost data speed and density, and lower system costs in large data centers and telecom equipment, much like moving a power outlet next to a heavy appliance to avoid long, inefficient extension cords.

fmcw lidars technical

"...optical circuit switching, FMCW LiDARs for Physical AI, and quantum computing."

FMCW LIDARs are a type of laser sensor that measures distance and motion by sending a continuous beam whose frequency is steadily changed and comparing the returning light, producing direct, high-resolution range and speed data. Investors care because this technology can deliver more accurate, longer-range, and interference-resistant sensing than older pulsed systems, improving safety and performance in markets like self-driving cars, industrial automation, and mapping—think of it as switching from a snapshot camera to a high-definition radar for machines.

silicon germanium bicmos technical

"Tower will also highlight its Silicon Germanium BiCMOS (SiGe) offerings that, together with its SiPho platform..."

A semiconductor manufacturing approach that puts high-speed silicon–germanium transistors and standard CMOS logic on the same chip, combining fast analog/RF performance with efficient digital processing. For investors, it matters because this hybrid lets devices handle wireless signals, sensors and mixed tasks more quickly and with less power—broadening product capabilities and market opportunities in areas like 5G, automotive electronics and high-speed networking, which can affect revenue and margins.

AI-generated analysis. How Rhea-AI works. Not financial advice.

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MIGDAL HAEMEK, Israel, March 4, 2026 - Tower Semiconductor (NASDAQ/TASE: TSEM), the leading foundry for high-value analog semiconductor solutions, today announced its participation in upcoming OFC 2026 (Optical Fiber Communication Conference and Exhibition), taking place March 17–19, 2026 at the Los Angeles Convention Center in Los Angeles, California, booth #2221. During the event days, company representatives will be available to discuss current and future silicon photonics roadmap.

The company will showcase its popular Silicon Photonics platform that has been the top choice for the industry leaders not only for optical transceivers for Scale-Out and Telecom, but also for exciting growing applications such as co-packaged optics (CPO) for Scale-Up architecture, DWDM lasers, optical circuit switching, FMCW LiDARs for Physical AI, and quantum computing. Tower will also highlight its Silicon Germanium BiCMOS (SiGe) offerings that, together with its SiPho platform, serve the rapidly growing need for higher bandwidth, lower latency and lower power requirements of next-generation AI infrastructure.

Several joint demonstrations with company's partners are planned throughout the event; a detailed schedule will be published on Tower's events webpage.

Additional information and OFC 2026:
Dates: March 17–19, 2026
Venue: Los Angeles Convention Center, Los Angeles, California

Booth: #2221

To learn more about Tower’s advanced silicon photonics (SiPho) platform and RF & HPA technology offerings, visit here.

About Tower Semiconductor
Tower Semiconductor Ltd. (NASDAQ/TASE: TSEM), the leading foundry of high-value analog semiconductor solutions, provides technology, development, and process platforms for its customers in growing markets such as consumer, industrial, automotive, mobile, infrastructure, medical and aerospace and defense. Tower Semiconductor focuses on creating a positive and sustainable impact on the world through long-term partnerships and its advanced and innovative analog technology offering, comprised of a broad range of customizable process platforms such as SiPho, SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS image sensor, non-imaging sensors, displays, integrated power management (BCD and 700V), and MEMS. Tower Semiconductor also provides world-class design enablement for a quick and accurate design cycle as well as process transfer services including development, transfer, and optimization, to IDMs and fabless companies. To provide multi-fab sourcing and extended capacity for its customers, Tower Semiconductor currently owns one operating facility in Israel (200mm), two in the U.S. (200mm), and two in Japan (200mm and 300mm) which it owns through its 51% holdings in TPSCo and shares a 300mm facility in Agrate, Italy with STMicroelectronics. For more information, please visit: www.towersemi.com.

Safe Harbor Regarding Forward-Looking Statements
This press release includes forward-looking statements, which are subject to risks and uncertainties. Actual results may vary from those projected or implied by such forward-looking statements. A complete discussion of risks and uncertainties that may affect the accuracy of forward-looking statements included in this press release or which may otherwise affect Tower’s business is included under the heading “Risk Factors” in Tower’s most recent filings on Forms 20-F, F-3, F-4 and 6-K, as were filed with the Securities and Exchange Commission (the “SEC”) and the Israel Securities Authority. Tower does not intend to update, and expressly disclaim any obligation to update, the information contained in this release. 

Tower Semiconductor Company Contact: Orit Shahar | +972-74-7377440 | oritsha@towersemi.com
Tower Semiconductor Investor Relations Contact: Liat Avraham | +972-4-6506154 | liatavra@towersemi.com

Attachment

• OFC_2026_ PR_Final

FAQ

AI-generated questions and answers. How Rhea-AI works. Not financial advice.

When will Tower Semiconductor (TSEM) exhibit at OFC 2026?

Tower Semiconductor will exhibit at OFC 2026 from March 17–19, 2026 at the Los Angeles Convention Center. According to the company, booth #2221 will host product demos and meetings on its Silicon Photonics and SiGe BiCMOS platforms.

What will Tower Semiconductor (TSEM) showcase at OFC 2026?

Tower will showcase its Silicon Photonics (SiPho) platform and Silicon Germanium BiCMOS offerings at OFC 2026. According to the company, demonstrations will cover optical transceivers, co‑packaged optics, DWDM lasers, FMCW LiDAR and quantum computing applications.

Where can investors find Tower Semiconductor (TSEM) at OFC 2026 in Los Angeles?

Investors can find Tower Semiconductor at booth #2221 at the Los Angeles Convention Center during OFC 2026. According to the company, representatives will be available for roadmap discussions and scheduled partner demonstrations throughout the event.

Will Tower Semiconductor (TSEM) present technical demonstrations at OFC 2026?

Yes, Tower Semiconductor plans several joint demonstrations with partners during OFC 2026. According to the company, a detailed demo schedule will be published on Tower’s events webpage ahead of the March 17–19 conference.

How does Tower Semiconductor (TSEM) position its SiPho and SiGe technologies for AI and telecom?

Tower positions SiPho and SiGe BiCMOS as solutions for higher bandwidth, lower latency and lower power needs in next‑generation AI and telecom. According to the company, these platforms support Scale‑Out and Scale‑Up architectures and emerging physical AI applications.