Veeco Instrs Inc Del Stock Price, News & Analysis

Veeco (NASDAQ: VECO) announced an evaluation shipment of its laser spike annealing (LSA) system to a leading semiconductor memory company for advanced DRAM R&D. The shipment expands Veeco's presence in the DRAM market and is positioned as a step toward high-volume manufacturing (HVM) adoption for next-generation DRAM and high bandwidth memory (HBM).

The evaluation is expected to last about one year, with follow-on orders anticipated in 2027 and beyond. Veeco says the LSA platform delivers high-temperature, millisecond annealing with reduced thermal budgets and claims market-leading performance and cost of ownership. Yole projects HBM market CAGR at ~30% through 2030, reaching about $100B annualized.

Veeco (NASDAQ: VECO) reported Q3 2025 revenue of $165.9 million, down from $184.8 million a year earlier. GAAP net income was $10.6 million, or $0.17 diluted EPS, versus $22.0 million, or $0.36 diluted EPS, in Q3 2024. Non-GAAP net income was $21.8 million, or $0.36 diluted EPS, versus $28.3 million, or $0.46 diluted EPS, a year ago.

Management highlighted order wins for 300mm GaN single‑wafer and AsP batch MOCVD systems and reiterated the pending merger with Axcelis. Q4 2025 guidance: revenue $155M–$175M, GAAP diluted EPS (loss) $(0.07)–$0.05, and Non‑GAAP diluted EPS $0.16–$0.32. A conference call was scheduled for Nov 5, 2025 at 5:00pm ET.

Veeco (NASDAQ: VECO) received an order for a Propel®300 MOCVD system from a leading power semiconductor IDM for GaN epitaxy on 300mm Si wafers. The order reinforces Veeco’s position in 300mm MOCVD technology and follows prior Propel®300 shipments across compound semiconductor markets.

Veeco highlights a 2.3x chip-per-wafer advantage moving from 200mm to 300mm, compatibility with existing 300mm production lines, and features including TurboDisc MOCVD technology, automated wafer handling, best-in-class thickness and doping uniformity, low defectivity, and long campaigns without in-situ cleaning. Yole Group projects the GaN device market to grow at a 35% CAGR from $555M (2025) to $2.5B (2030), driven by automotive, industrial, and data center power-efficiency demand.

Veeco (NASDAQ: VECO) announced multiple orders for its WaferStorm, WaferEtch and AP300 wet processing and lithography systems from a leading specialist foundry to support advanced packaging and silicon photonics.

Deliveries are scheduled to begin in Q1 2026. Systems will target applications across AI, automotive, aerospace and defense, and communications, and include processes such as Cu pillars, flip-chip bumping, FOWLP and high-density fan-out packaging.

Veeco (NASDAQ: VECO) will release Q3 2025 financial results after market close on Wednesday, November 5, 2025. The company will host a conference call to review results at 5:00 PM ET the same day.

To join by phone dial 1-877-407-8029 (toll-free) or 1-201-689-8029. A live webcast will be available at ir.veeco.com, and a replay will be posted on Veeco's website beginning at 8:00 PM ET on November 5, 2025.

Investor and media contact names and phone numbers are provided for follow-up.

Veeco (NASDAQ: VECO) said on October 14, 2025 that a leading optical communications laser manufacturer ordered multiple Lumina MOCVD systems, naming Lumina as the customer’s production tool of record for InP epitaxy on 4-inch and 6-inch wafers.

The systems will fabricate InP lasers for datacom optical transceivers. Veeco highlighted TurboDisc technology, within-wafer and wafer-to-wafer uniformity, low defectivity, continuous long campaigns without reactor clean interruptions, and seamless wafer-size transition up to 6 inches.

Market context: Yole forecasts a 13% CAGR for datacom optical transceivers from $8.1B in 2024 to $14.7B in 2029, driven by AI intra-data-center demand.

Veeco (NASDAQ: VECO) launched the Lumina+ MOCVD system and secured a first commercial multi‑tool order from Rocket Lab (NASDAQ: RKLB) on Oct 6, 2025. The tools support Rocket Lab’s CHIPS Act‑backed project to expand domestic compound semiconductor production and will be installed at Rocket Lab’s Albuquerque facility.

The release says Lumina+ offers the largest As/P batch size in MOCVD, best‑in‑class throughput, lowest cost per wafer, and industry‑leading uniformity, enabling Rocket Lab to double production capacity for space‑grade solar cells.

Axcelis Technologies (NASDAQ:ACLS) and Veeco Instruments have announced a transformative all-stock merger creating a semiconductor equipment company with an estimated $4.4 billion enterprise value. Under the agreement, Veeco shareholders will receive 0.3575 Axcelis shares for each Veeco share, resulting in Axcelis shareholders owning 58% and Veeco shareholders 42% of the combined entity.

The merged company will be headquartered in Beverly, Massachusetts, with Dr. Russell Low as CEO. On a pro-forma basis for FY2024, the combined company generated $1.7 billion in revenue, 44% non-GAAP gross margin, and $387 million in adjusted EBITDA. The merger is expected to achieve $35 million in annual cost synergies within 24 months and be accretive to non-GAAP earnings per share within the first year post-closing.

Veeco Instruments (NASDAQ: VECO), a leading manufacturer of semiconductor process equipment, has announced its participation in six major technology and semiconductor investor conferences throughout August and September 2025.

The company will present at events including the Oppenheimer Technology Conference (August 12), Needham Semiconductor Conference (August 21), Jefferies Technology Conference (August 26), Evercore ISI Conference (August 27), Benchmark TMT Conference (September 3), and Citi Global TMT Conference (September 4). The Oppenheimer conference presentation will be available via webcast on Veeco's investor relations website.