Vishay Intertechnology Releases New Top-Side Cooling Mount Thick Film Power Resistor in Compact TO-263 (D²PAK) Package
The design aims to lower circuit-board temperatures and reduce thermal stress on nearby components.
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Rhea-AI Summary
Vishay Intertechnology (VSH) introduced the D2TO35S, an automotive-grade power resistor designed for top-side cooling in a compact TO-263 package.
The surface-mount device delivers 35 W of power dissipation at 25 °C. It transfers heat to a heatsink instead of relying on circuit-board cooling. Vishay says it can deliver up to nine times the power dissipation of standard board-mounted devices when paired with an appropriate heatsink. Samples and production quantities are available now, with lead times of fourteen weeks.
Key Figures
- Power dissipation
- 35 W
- At 25 °C in the TO-263 (D²PAK) package
- Power dissipation versus standard devices
- Up to nine times greater
- When paired with an appropriate heatsink
- Resistance range
- 4.7 Ω to 550 kΩ
- D2TO35S device
- Resistance tolerance
- Down to ± 1 %
- D2TO35S device
- Thermal resistance
- 4.28 °C/W
- D2TO35S device
- TCR
- Down to ± 150 ppm/°C
- D2TO35S device
- Operating temperature range
- -55 °C to +175 °C
- D2TO35S device
- Lead time
- Fourteen weeks
- Samples and production quantities available now
Key Terms
thick film technical
TO-263 technical
non-inductive technical
tcr technical
rohs-compliant regulatory
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Automotive Grade Device Delivers 35 W Power Dissipation While Enhancing Thermal Performance and Saving Space
MALVERN, Pa., Sept. 29, 2026 (GLOBE NEWSWIRE) -- Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new Automotive Grade top-side cooling mount thick film power resistor. Designed for automotive applications, the Vishay Sfernice D2TO35S improves thermal performance and reduces board space requirements, while delivering high power dissipation of 35 W at 25 °C in the surface-mount TO-263 (D²PAK) package.
As thermal constraints increasingly become the primary system design limitation, many power components are transitioning from PCB-based cooling to top-side cooled architectures. By transferring heat directly to a heatsink, the D2TO35S released today enables up to nine times greater power dissipation than standard PCB-mounted devices when paired with an appropriate heatsink. Its compact, surface-mount design allows designers to increase power dissipation within the same footprint or provide the same functionality in a smaller footprint, while lowering PCB temperatures, reducing thermal stress on neighboring components, and improving overall system reliability.
Offering a non-inductive design for improved signal integrity and power handling in fast transient conditions, the D2TO35S features a resistance range from 4.7 Ω to 550 kΩ — with tolerances down to ± 1 % — thermal resistance of 4.28 °C/W, TCR down to ± 150 ppm/°C, and a wide operating temperature range from -55 °C to +175 °C. The RoHS-compliant device is solder reflow secure at 270 °C/10 s.
Samples and production quantities of the D2TO35S are available now with lead times of fourteen weeks.
Vishay manufactures one of the world’s largest portfolios of discrete semiconductors and passive electronic components that are essential to innovative designs in the automotive, industrial, computing, consumer, telecommunications, military, aerospace, and medical markets. Serving customers worldwide, Vishay is The DNA of tech.® Vishay Intertechnology, Inc. is a Fortune 1000 Company listed on the NYSE (VSH). More on Vishay at www.Vishay.com.
The DNA of tech® is a registered trademark of Vishay Intertechnology, Inc.
Vishay on Facebook: http://www.facebook.com/VishayIntertechnology
Vishay Twitter feed: http://twitter.com/vishayindust
Links to product datasheets:
http://www.vishay.com/ppg?51112 (D2TO35S)
Link to product photo:
https://www.flickr.com/photos/vishay/albums/72177720335659880
For more information please contact:
Vishay Intertechnology
Peter Henrici, +1 408 567-8400
peter.henrici@vishay.com
or
Redpines
Bob Decker, +1 415 409-0233
bob.decker@redpinesgroup.com