Taiwan Semiconductor Manufacturing Company Ltd. filings document the reporting framework of a foreign private issuer and ADR whose U.S. disclosures include Form 6-K current reports and annual Form 20-F materials. The filings cover consolidated revenue reports, quarterly earnings presentations, accounting differences between Taiwan-IFRSs and IASB-issued IFRSs, and operating results for the company's semiconductor foundry business.
TSMC's regulatory disclosures also address shareholder meeting agendas, business reports and financial statements, Audit and Risk Committee review materials, earnings distribution, directors' compensation, employee profit-sharing bonuses, amendments to corporate procedures, unsecured bond issuance, asset acquisitions and dispositions, capital appropriations, share cancellations, and changes in shareholdings or pledges by directors, executive officers and large shareholders.
TSMC reported strong second-quarter and six-month results and approved major capital actions to support long-term capacity. Second-quarter consolidated revenue was NT$933.79 billion with net income of NT$398.27 billion and diluted EPS of NT$15.36. The Board approved a NT$5.0 per share cash dividend, with record date set for December 17, 2025 and dividend payment on January 8, 2026.
The Board also approved significant funding and financing measures: capital appropriations of approximately US$20,657.50 million for capacity, packaging and fab construction; issuance of unsecured domestic bonds up to NT$60 billion to finance expansion and green initiatives; and a capital injection of up to US$10 billion to TSMC Global to address foreign-exchange hedging costs. Six-month consolidated figures (TIFRS) include net sales of 1,773,045,533 (in NT$ thousands) and net income of 758,226,085 (in NT$ thousands), with basic EPS of NT$29.31.
TSMC’s July 2025 6-K highlights continued top-line momentum. Consolidated revenue reached NT$323.17 bn, up 22.5% versus June and 25.8% year-on-year. Cumulative Jan-Jul revenue climbed to NT$2,096.21 bn, a 37.6% YoY increase, underscoring robust demand for the foundry’s advanced process nodes.
Liquidity activities remain routine and intra-group focused. Subsidiary lending outstanding totaled NT$15.95 bn (TSMC China NT$14.15 bn; TSMC Development NT$1.80 bn) against board-approved limits of about NT$137 bn. Guarantees to wholly-owned units stood at NT$554.34 bn, well below the aggregate limit of NT$2.50 tn.
Derivative positions were sizeable but manageable: the parent company carried NT$118.40 bn notional forward contracts with an unrealized loss of NT$3.88 bn; other subsidiaries recorded minor unrealized losses. No hedge-accounted contracts show material mark-to-market impact.
No major transactions, earnings guidance, or management changes were disclosed.
On 21 Jul 2025, Taiwan Semiconductor Manufacturing Co. (TSM) filed a Form 6-K/A that only amends Exhibit 99.1—the Q2 2025 earnings conference presentation. The revision is limited to page 9, where the 2025 revenue outlook wording changes from “to increase by close to 30%” to “to increase by around 30%.” No financial figures, guidance ranges, or other disclosures are updated. The filing therefore carries no material impact on previously communicated expectations and serves solely as a textual clarification.
Taiwan Semiconductor Manufacturing Company (NYSE: TSM) filed a Form 6-K for June 2025 detailing corporate actions taken during May 2025.
Capital appropriations dominate the report: the board approved US$15.248 billion of new spending, including US$9.590 billion for advanced-node production equipment, US$308 million for advanced packaging and specialty processes, and US$5.350 billion for real-estate and leased assets. These investments signal continued capacity expansion to meet leading-edge demand.
The filing also discloses NT$16.3 billion in fixed-income asset purchases and NT$0.4 billion in dispositions, illustrating ongoing treasury management.
Insider ownership changes were minor: Senior Vice President Wei-Jen Lo reduced holdings by 5,000 shares, while Vice President Jonathan Lee added 1,234 shares; no pledges were reported.
The board cancelled 117,721 common shares reclaimed from lapsed employee restricted-stock awards, reducing paid-in capital by NT$1,177,210. No unsecured bonds were issued during the period.
Taiwan Semiconductor Manufacturing Company (NYSE:TSM) filed a Form 6-K for June 2025 reporting an internal capital move. A written resolution of wholly-owned subsidiary TSMC Global Ltd., dated 25 June 2025, authorized the issuance of 10,000 new shares with a par value of US$1,000,000 each to the parent company. The transaction adds up to US$10 billion of additional paid-in capital at the subsidiary level, strengthening its balance sheet without introducing external investors or shareholder dilution at the TSM level.
No other material events, financial statements, risk factors, legal proceedings, or management changes are disclosed in the submission. The report was signed by Senior Vice President & CFO Wendell Huang on behalf of the registrant.