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TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD SEC Filings

TSM NYSE

Welcome to our dedicated page for TAIWAN SEMICONDUCTOR MANUFACTURING CO SEC filings (Ticker: TSM), a comprehensive resource for investors and traders seeking official regulatory documents including 10-K annual reports, 10-Q quarterly earnings, 8-K material events, and insider trading forms.

Our SEC filing database is enhanced with expert analysis from Rhea-AI, providing insights into the potential impact of each filing on TAIWAN SEMICONDUCTOR MANUFACTURING CO's stock performance. Each filing includes a concise AI-generated summary, sentiment and impact scores, and end-of-day stock performance data showing the actual market reaction. Navigate easily through different filing types including 10-K annual reports, 10-Q quarterly reports, 8-K current reports, proxy statements (DEF 14A), and Form 4 insider trading disclosures.

Designed for fundamental investors and regulatory compliance professionals, our page simplifies access to critical SEC filings. By combining real-time EDGAR feed updates, Rhea-AI's analytical insights, and historical stock performance data, we provide comprehensive visibility into TAIWAN SEMICONDUCTOR MANUFACTURING CO's regulatory disclosures and financial reporting.

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Taiwan Semiconductor Manufacturing Co. vice president Tien Bor-Zen made an open-market purchase of 1,000 common shares at $55.93 per share on March 22, 2026. After this transaction, he directly holds 9,051 common shares.

He also has indirect exposure through 48 common shares held via the company’s Employee Stock Purchase Plan trust and 44 common shares held by an immediate family member. In addition, he holds equity linked notes with a $20,000 principal that reference a basket including TSM American Depositary Shares and may settle in up to 71 ADS at a strike price of $278.8973 per ADS if TSM becomes the worst-performing basket component at maturity on June 3, 2026.

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TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD executive files initial ownership report showing existing holdings rather than new trades. SVP and Deputy Co-COO Hou Yung-Chin reports direct ownership of 662,403 Common Shares (2330.TW), plus indirect interests through employee plans and family.

The filing lists 7,130 Common Shares held through an Employee Stock Purchase Plan trust and 20,190 Common Shares held by a trust funded under the Long-Term Incentive Bonus Plan, where he has investment control. A further 60,802 Common Shares are reported as indirectly owned through his spouse.

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Taiwan Semiconductor Manufacturing Co. Ltd. senior vice president and general counsel Fang Shu-Hua has filed an initial ownership report showing substantial holdings of the company’s common shares. The filing lists 858,392 common shares held directly.

In addition, the report discloses indirect ownership of common shares through several channels: an Employee Stock Purchase Plan trust, a Long-Term Incentive bonus plan trust, the filer’s spouse, an immediate family member, and entities named Ming Yuan Capital Co., Ltd. and Ming Jing Capital Co., Ltd. The entry reflects existing ownership positions rather than new reported purchases or sales.

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Taiwan Semiconductor Manufacturing Co. Ltd. senior vice president Ho Li-Mei filed an initial statement of beneficial ownership of common shares. The filing reports direct ownership of 4,644,012 common shares (2330.TW), plus indirect holdings of 9,203 shares through an ESPP trust, 20,190 shares through an LTI bonus plan trust, and 2,039,530 shares held by a spouse.

Footnotes explain that the ESPP position consists of shares purchased and held under the company’s Employee Stock Purchase Plan, while the LTI trust shares were bought with cash from the Long-Term Incentive Bonus Plan, over which the filer has investment control.

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Taiwan Semiconductor Manufacturing Co. senior vice president Tzonz‑Sheng Chang has filed a Form 3 reporting his share holdings. He directly holds 317,638 Common Shares (2330.TW), plus 5,146 shares held by an Employee Stock Purchase Plan trust and 10,581 shares held by a Long-Term Incentive bonus plan trust.

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TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD Controller Chih-Ho Chen filed an initial statement of beneficial ownership of the company’s common shares. The Form 3 shows direct ownership of 5,259 common shares, plus indirect ownership of 363 common shares held by a spouse and 8,000 common shares held through Homewarm Advisory Co., Ltd. This filing establishes the controller’s equity position across both personal and related-entity holdings as of the reported date, without reporting any new share purchases or sales.

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Taiwan Semiconductor Manufacturing Co. Ltd. VP Chuang Juiping has filed an initial Form 3 detailing existing ownership in the company. The filing shows direct ownership of 239,738 Common Shares (2330.TW) and 50 American Depositary Shares, each representing five Common Shares.

The disclosure also lists indirect interests, including Common Shares held through an Employee Stock Purchase Plan trust, a Long-Term Incentive bonus plan trust, and by the reporting person’s spouse. This Form 3 records current beneficial ownership and does not reflect new purchases or sales.

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Taiwan Semiconductor Manufacturing Co. Ltd. VP Chen Pei-Hung filed an initial Form 3 reporting existing ownership of the company’s common shares. The filing does not show any recent buy or sell transactions; it simply establishes Chen’s current holdings.

Chen directly owns 433,414 common shares. In addition, there are indirect holdings, including 1,107 common shares held through an Employee Stock Purchase Plan trust, 7,036 common shares held by a trust funded through the Long-Term Incentive Bonus Plan over which Chen has investment control, and 83,143 common shares held by Chen’s spouse.

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TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD VP Hsu Kuo-Chin has filed an initial statement of beneficial ownership, reporting equity holdings in both common shares and American Depositary Shares. This Form 3 does not show any new buy or sell transactions; it records existing positions as of the reported date.

He directly holds 178,924 Common Shares (2330.TW) and 6,050 American Depositary Shares (TSM). He also has indirect interests in 6,393 common shares through an Employee Stock Purchase Plan trust, 7,036 common shares through a Long-Term Incentive trust, and 12,000 common shares held by his spouse. In addition, his spouse holds 1,988 American Depositary Shares. A footnote states that each American Depositary Share represents five Common Shares.

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TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD executive Chin Yung-Pei, EVP and Co-COO, filed an initial ownership statement reporting common share holdings. The filing lists 5,171,935 common shares held directly, plus indirect interests of 8,059 shares through an ESPP trust, 63,345 shares through a Long-Term Incentive trust, and 4,190,107 shares held by a spouse.

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FAQ

How many TAIWAN SEMICONDUCTOR MANUFACTURING CO (TSM) SEC filings are available on StockTitan?

StockTitan tracks 253 SEC filings for TAIWAN SEMICONDUCTOR MANUFACTURING CO (TSM), including 10-K annual reports, 10-Q quarterly reports, 8-K current reports, and Form 4 insider trading disclosures. Each filing includes AI-generated summaries, impact scoring, and sentiment analysis.

When was the most recent SEC filing for TAIWAN SEMICONDUCTOR MANUFACTURING CO (TSM)?

The most recent SEC filing for TAIWAN SEMICONDUCTOR MANUFACTURING CO (TSM) was filed on March 24, 2026.