STOCK TITAN

Fabric.AI and Kopin Expand Neural I/o™ Program with Several New Non-Disclosure Agreements Across the AI Interconnect Ecosystem

(Positive)
Tags
AI

Fabric.AI (Nasdaq: FABC)/b) announced expanded industry engagement for its Neural I/o™ MicroLED-based optical interconnect platform, including several new non-disclosure agreements with prospective participants in the AI interconnect ecosystem. According to Fabric.AI, these NDAs include multiple companies that are part of NVIDIA's NVLink ecosystem and are entered into under the Neural I/o initiative being developed with .

The additional agreements broaden the group of industry players evaluating Neural I/o for next-generation AI infrastructure. Fabric.AI describes Neural I/o as a massively parallel MicroLED-based optical architecture aimed at moving large data volumes efficiently between GPUs, accelerators, memory and other components, with a planned technology demonstration at CES 2027.

Loading...
Loading translation...

Positive

  • None.

Negative

  • None.

Market reaction after Neural I/o NDA expansion: KOPN -3.65% in the Aug 12 session

-3.65% 11.2x vol
4 alerts
-3.65% Session close to close
-13.5% Trough Tracked
$919.42M Market Cap
11.2x Rel. Volume

In the Aug 12 session, KOPN declined 3.65%, reflecting a moderate negative market reaction. Argus tracked a trough of -13.5% from its starting point during tracking. Our momentum scanner triggered 4 alerts that day, indicating moderate trading interest and price volatility. Trading volume was exceptionally heavy at 11.2x the daily average, suggesting significant selling pressure.

Data tracked by StockTitan Argus on the day of publication.

Market Context

The prior AI-tagged events averaged a 15.12% 24-hour move, placing this NDA expansion within a recen...
Analysis

The prior AI-tagged events averaged a 15.12% 24-hour move, placing this NDA expansion within a recent Neural I/o engagement pattern. The announcement describes evaluation activity rather than commercial agreements, leaving integration progress to watch.

Key Figures

Planned demonstration: CES 2027
1 metrics
Planned demonstration CES 2027 Neural I/o optical interconnect platform

Previous AI Reports

2 past events · Latest: Aug 11 (Positive)
Same Type Pattern 2 events
Date Event Sentiment 24h Move Catalyst
Aug 11 CES demonstration plans Positive +24.0% Confirmed first public live demonstration remained scheduled for CES 2027
Aug 03 Technology white paper Positive +6.3% Published white paper on MicroLED optical interconnect technology

24h Move is the share-price change in the day after each event; other market factors may also have contributed.

Pattern Detected

The two tag-specific AI announcements both aligned with positive 24-hour reactions of 23.99% and 6.25%.

Key Terms

non-disclosure agreements, fabless semiconductor technologies, optical interconnect, optical transceivers, +1 more
5 terms
non-disclosure agreements regulatory
"including the signing of several new non-disclosure agreements (NDAs)"
A non-disclosure agreement (NDA) is a legal contract where one or more parties promise to keep specified information private, like agreeing not to share a company’s secret recipe or plans. For investors, NDAs matter because they protect sensitive details about deals, technology, finances or strategy that can affect a company’s value; knowing an NDA is in place can signal seriousness, reduce rumor risk, and preserve future competitive advantage.
fabless semiconductor technologies technical
"developing a suite of fabless semiconductor technologies"
A business model and set of practices where a company designs and develops semiconductor chips but outsources the actual wafer fabrication and packaging to specialized foundries and contractors. Like a fashion designer who creates clothes but hires factories to sew them, fabless firms concentrate on research, design and intellectual property while relying on external manufacturers; that structure matters to investors because it changes capital needs, profit drivers, supply-chain risk and strategic partnerships.
optical interconnect technical
"Neural I/o™ MicroLED-based optical interconnect platform"
Optical interconnect is a way of linking electronic components using pulses of light instead of traditional electrical wires, like swapping copper cables for fiber-optic highways inside and between devices. It matters to investors because light-based connections can carry much more data, use less power and generate less heat than electrical links, which can lower operating costs and enable faster, more scalable products for data centers, telecom and high-performance computing markets.
optical transceivers technical
"MicroLED pixels as ultra-high-speed, low-power optical transceivers"
Optical transceivers are small hardware modules that convert electrical signals into pulses of light and back again so data can travel over fiber-optic cables; think of them as translators that let computers and network equipment “talk” over long distances at very high speed. They matter to investors because demand, supply constraints, and price changes for these components directly affect the growth and profitability of companies serving data centers, telecom networks, and cloud services, similar to how a shortage of car engines would impact auto makers.
microled technical
"massively parallel MicroLED-based optical architecture"
MicroLED is a type of display technology that uses tiny, individual light-emitting tiles to create images with bright colors, sharp contrast, and wide viewing angles. Because of their efficiency and high quality, microLED screens can provide clearer and more vibrant visuals, which can enhance the appeal and performance of electronic devices. For investors, advancements in microLED technology may signal potential growth opportunities in the electronics and display markets.

AI-generated analysis. How Rhea-AI works. Not financial advice.

See more from StockTitan in Google Search and AI answers. Adds StockTitan as a preferred source · opens Google
Add on Google

NDAs include several with NVIDIA NVLink partners

NEW YORK, NY, Aug. 12, 2026 (GLOBE NEWSWIRE) -- Fabric.AI (Nasdaq: FABC) (“Fabric.AI” or the “Company”), an AI infrastructure company developing a suite of fabless semiconductor technologies for next-generation AI factories, today announced expanded industry engagement around its Neural I/o™ MicroLED-based optical interconnect platform, including the signing of several new non-disclosure agreements (NDAs) with prospective industry participants.

The new agreements, entered into as part of the Neural I/o initiative being developed with Kopin Corporation (Nasdaq: KOPN), include several companies that are currently part of NVIDIA's NVLink ecosystem. The additional NDAs expand the group of industry participants evaluating the potential applicability of Neural I/o within next-generation AI infrastructure.

Neural I/o is designed to address one of the most significant challenges facing increasingly powerful AI systems: moving growing volumes of data efficiently between GPUs, accelerators, memory and other computing components. The platform utilizes a massively parallel MicroLED-based optical architecture intended to provide a scalable alternative to conventional interconnect technologies.

“The signing of additional NDAs, particularly with companies already participating in the NVIDIA NVLink ecosystem, represents another meaningful step in expanding industry engagement around Neural I/o," said Josh Silverman, Fabric.AI Chief Executive Officer.  "As we continue to advance the technology toward our planned CES 2027 demonstration, we believe the combination of continued technical development, growing industry engagement and increasing awareness of AI interconnect constraints further strengthens the commercial foundation for Neural I/o."

“These discussions provide important opportunities to validate potential use cases, better understand integration requirements and expand the potential pathways toward commercialization,” concluded Silverman.

About Fabric.AI

Fabric.AI (Nasdaq: FABC) is an AI infrastructure company developing a suite of fabless semiconductor technologies for next-generation AI factories, including its Neural I/o™ MicroLED-based optical interconnect platform.

About Kopin Corporation

Kopin Corporation (Nasdaq: KOPN) is a leading developer and provider of innovative display and application-specific optical solutions for defense, AI infrastructure, enterprise, professional and consumer products. Kopin’s portfolio includes microdisplays, display modules, eyepieces and projection assemblies, and vehicle- and head-mounted display systems built on Kopin’s liquid crystal, MicroLED and OLED display technologies, along with a range of optics and low-power custom silicon. Building on its patented bi-directional NeuralDisplay™ architecture, Kopin is also developing Neural I/o optical interconnects that use programmable MicroLED pixels as ultra-high-speed, low-power optical transceivers for AI data centers. For more information, please visit Kopin’s website at www.kopin.com.

Follow Kopin on LinkedIn, X and Facebook.

Forward-Looking Statements

This press release contains forward-looking statements within the meaning of the federal securities laws, including statements regarding the expected timing, demonstration and capabilities of the Neural I/o platform, as well as third-party projections regarding market size and growth. These statements are based on current expectations and are subject to risks and uncertainties — including development, integration and manufacturing risks — that could cause actual results to differ materially. Market and industry data are derived from third-party sources believed to be reliable but have not been independently verified by the Company. A discussion of these and other factors with respect to the Company is set forth in the Company’s most recent Annual Report on Form 10-K and subsequent Quarterly Reports on Form 10-Q and Current Reports on Form 8-K filed with the Securities and Exchange Commission. Forward-looking statements speak only as of the date they are made, and the Company disclaims any intention or obligation to revise any forward-looking statements, whether as a result of new information, future events or otherwise.

IR Contact:
CORE IR
212-644-0924
ir@fabric-ai.co

Media Contact:
Fabric.AI
press@fabric-ai.co
www.fabricai.com 


FAQ

What did Fabric.AI (FABC) announce about new NDAs for its Neural I/o platform on August 12, 2026?

Fabric.AI announced several new non-disclosure agreements for its Neural I/o optical interconnect platform, expanding industry engagement. According to Fabric.AI, the NDAs involve prospective industry participants evaluating Neural I/o’s applicability in next-generation AI infrastructure and are part of its ongoing initiative with Kopin.

What is Fabric.AI’s Neural I/o MicroLED-based optical interconnect and what problem does it target?

Neural I/o is a MicroLED-based optical interconnect platform designed to move large data volumes efficiently between GPUs, accelerators, memory and other components. According to Fabric.AI, its massively parallel optical architecture is intended as a scalable alternative to conventional interconnect technologies in advanced AI systems.

What role does Kopin (KOPN) play in the Neural I/o optical interconnect program with Fabric.AI?

Kopin is developing Neural I/o optical interconnects as part of its display and optical solutions portfolio, working with Fabric.AI on the initiative. According to Kopin, Neural I/o uses programmable MicroLED pixels as ultra-high-speed, low-power optical transceivers for AI data centers.

When does Fabric.AI (FABC) plan to demonstrate the Neural I/o platform, and in what context?

Fabric.AI plans a Neural I/o technology demonstration at CES 2027. According to Fabric.AI, ongoing technical development and increased industry engagement, including new NDAs, are steps toward this planned demonstration and may help assess commercialization pathways for the interconnect platform.

What does Kopin’s NeuralDisplay architecture contribute to the Neural I/o interconnects for AI infrastructure (KOPN)?

Kopin’s patented bi-directional NeuralDisplay architecture underpins Neural I/o optical interconnects by using programmable MicroLED pixels as optical transceivers. According to Kopin, this approach targets ultra-high-speed, low-power data links suitable for AI data centers and broader AI infrastructure applications.