Lumentum Showcases Breakthrough Optical Scale-Up Demonstration at OFC 2026 Using VCSEL Technology
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vcseltechnical
A VCSEL is a tiny semiconductor laser that emits light straight out of the surface of a chip, like a miniature, very precise flashlight built into an electronic component. Investors care because VCSELs are key parts in optical communication, sensors, and proximity or gesture controls—products with growing demand—so changes in VCSEL supply, cost or adoption can affect a maker’s sales, margins and the competitive position of companies that rely on them.
asictechnical
ASIC is Australia’s corporate, markets and financial services regulator that enforces rules for companies, financial advisers and market operators; think of it as the referee and rulebook keeper for financial activity. It matters to investors because ASIC’s oversight, investigations and enforcement actions affect company credibility, legal risk and market fairness—actions that can change stock prices, investor confidence and the safety of financial products.
ucietechnical
UCIe (Universal Chiplet Interconnect Express) is an industry standard for connecting small processor or memory building blocks, called chiplets, inside a single package so they work together like parts of a single chip. For investors, it matters because it can lower manufacturing costs, speed product development, and enable more flexible, high-performance semiconductors—similar to using interchangeable Lego pieces instead of carving one large block—potentially affecting makers’ competitiveness and profit margins.
pcietechnical
PCIe (PCI Express) is a high-speed connection standard used inside computers and servers to link components like graphics cards, storage drives, and network adapters so they can send data quickly to each other. Investors care because faster, more efficient PCIe support can make a product more competitive—think of it as wider, faster highway lanes for data—which affects device performance, upgrade flexibility, manufacturing cost and customer demand.
fan-out wafer-level packagetechnical
A fan-out wafer-level package is a way of enclosing a finished semiconductor chip that spreads its electrical connections outward over a slightly larger area, creating more room for pins and wiring without increasing chip size. Think of attaching a small stamp to a larger postcard so you can draw more pathways out from the stamp; the result is a thinner, higher-performance, and often less expensive module. Investors care because this packaging can reduce manufacturing cost, improve device speed and power efficiency, and enable smaller or more feature-rich products that affect demand, margins, and supply-chain choices.
multimode fibertechnical
A multimode fiber is a type of optical cable that carries data as pulses of light through a relatively wide glass core, allowing multiple light paths to travel side by side—think of it like a multi-lane highway for light signals. Investors care because it is a lower-cost solution for short-range, high-bandwidth links in data centers and buildings; demand and upgrades affect hardware makers, installers, and network operators’ spending and profit outlooks.
silicon photonicstechnical
Silicon photonics is the technology that uses tiny structures etched into silicon chips to generate, control and detect light for moving data and sensing, essentially putting optical fiber functions onto a computer chip. For investors, it matters because it can dramatically increase data speed and energy efficiency in data centers, telecom networks and advanced sensors, potentially lowering costs and enabling new products much like replacing many metal wires with faster, low-power optical highways.
SAN JOSE, Calif.--(BUSINESS WIRE)--
Lumentum Holdings Inc. (“Lumentum”), a global leader in photonic solutions, today announced a breakthrough optical interconnect solution designed to support next-generation AI infrastructure using VCSEL technology. This solution offers a scalable optical platform for next-generation rack-level architectures to address the bandwidth, power, and integration challenges of AI scale-up networks. Attendees can see the demonstration at Lumentum’s booth #1439 during OFC, March 17–19, at the Los Angeles Convention Center.
The solution is presented in a host evaluation system and features a high-density multimode 1060nm VCSEL array co-packaged with a host ASIC, targeting “slow and wide” scale-up protocols such as UCIe and PCIe. It is implemented in a fan-out wafer-level package, leveraging standard semiconductor packaging flows, and advanced multimode fiber connectivity.
The 1060nm VCSELs and photodetectors are integrated in a two-dimensional monolithic array incorporating backside lens technology to enable precise optical alignment and superior signal integrity. The array architecture also supports channel sparing for enhanced system reliability. Designed for demanding environments, the platform supports high-temperature operation exceeding 150°C and leverages the inherent reliability advantages of 1060nm VCSEL technology.
Lumentum’s 1060nm VCSEL platform is built on the company’s ultra-high-volume 3D sensing (3DS) manufacturing base, which has shipped more than 10 billion emitters to date. Compared to conventional 850nm datacom VCSELs, 1060nm devices deliver improved speed capability, superior high-temperature performance, and exceptional long-term reliability. As a VCSEL-based scale-up solution, the platform also provides an independent supply chain alternative to silicon photonics and InP laser-based architectures.
“AI infrastructure is pushing the limits of conventional electrical interconnects,” said Matt Sysak, Chief Technology Officer at Lumentum. “Our 1060nm VCSEL scale-up platform optically enables ASICs with high shoreline bandwidth density, strong signal integrity, and thermal resilience, while providing a differentiated and highly reliable alternative to traditional silicon photonics-based approaches.”
About Lumentum
Lumentum (NASDAQ: LITE) is a global leader in optical and photonic technologies that power the networks and infrastructure behind AI, cloud computing, and next-generation communications. Built on decades of photonics innovation, Lumentum delivers high-performance lasers, modules, and optical subsystems that enable scalable, energy-efficient data center connectivity, advanced telecom networks, industrial manufacturing, and sensing applications. Headquartered in San Jose, California, the company operates R&D, manufacturing, and sales facilities worldwide. Learn more at www.lumentum.com.
