Vishay Intertechnology to Showcase Solutions for AI Infrastructure and Physical AI at PCIM Asia 2026

Rhea-AI Summary

Vishay Intertechnology (NYSE: VSH) will showcase a wide range of semiconductor and passive component solutions at PCIM Asia 2026, held Aug. 26-28 at the Shenzhen World Exhibition and Convention Center, Shenzhen, China. The exhibit in Hall 16, Booth C12 targets AI infrastructure and physical AI applications.

According to Vishay, demonstrations will cover AI power delivery from grid to board, including solid-state transformers, AC/DC PSUs, HVDC and DC/DC conversion, battery and capacitor backup units, hot-swap systems, software-defined vehicle power, humanoid robot motor control, and automotive power modules for EV/HEV and 48 V platforms.

Market Context

The comparable AI-tagged PCIM Asia 2025 showcase was followed by -2.85% over 24 hours, while this re...

Analysis

The comparable AI-tagged PCIM Asia 2025 showcase was followed by -2.85% over 24 hours, while this release supplied product specifications rather than financial guidance. The effective S-3ASR shelf remained a financing risk to monitor.

Key Figures

DC-Link capacitor rating: 11 µF, 1800 V Power capacitor rating: 310 µF, 2000 V Resistor working voltage: 5000 V +5 more

8 metrics

DC-Link capacitor rating 11 µF, 1800 V AI grid infrastructure SST reference design

Power capacitor rating 310 µF, 2000 V AI grid infrastructure SST reference design

Resistor working voltage 5000 V AI grid infrastructure SST reference design

Creepage distance 3.2 mm Gen 4 SiC Schottky diodes

PTC energy absorption 300 J HVDC power conversion exhibits

Inductor current capability 260 A BBU and CBU exhibits

Smart power stage current 50 A continuous, 80 A peak AEC-Q100 qualified SDV products

TVS surge protection 7 kW Automotive Grade TVS devices

Previous AI Reports

1 past event · Latest: Sep 19 (Neutral)

Same Type Pattern 1 events

Date	Event	Sentiment	24h Move	Catalyst
Sep 19	AI showcase	Neutral	-2.9%	PCIM Asia 2025 showcase of AI and EV semiconductor and passive technology solutions

24h Move is the share-price change in the day after each event; other market factors may also have contributed.

Pattern Detected

The prior AI-tagged PCIM Asia showcase was followed by a -2.85% 24-hour price reaction.

Key Terms

solid-state transformers, hvdc, sic mosfet, aec-q100, +1 more

5 terms

solid-state transformers technical

"For AI grid infrastructure, an SST reference design will feature components"

A solid-state transformer is an electrical device that uses power electronics instead of heavy metal coils to change voltage and steer electricity, acting like a digitally controlled, much lighter version of a traditional transformer. For investors, it matters because these units can boost efficiency, add fast remote control and protection features, and enable modern grid uses — such as electric-vehicle charging and renewable energy integration — which can change infrastructure costs and create new technology markets.

hvdc technical

"HVDC power conversion exhibits will highlight solutions for PFC"

HVDC, short for high‑voltage direct current, is a way of transmitting electricity as a steady one‑direction flow over long distances or undersea links instead of the usual back‑and‑forth alternating current. Like a high‑speed, nonstop pipeline for power, it cuts energy loss and can link different power grids or distant renewable sites more efficiently. Investors watch HVDC projects because they are large, long‑lived infrastructure investments that affect utility revenue, grid capacity, construction and regulatory risk, and the economics of power supply.

sic mosfet technical

"and SiC MOSFET power modules in the EMIPAK 2B package."

A SiC MOSFET is an electronic switch used to control high-voltage electricity, made from silicon carbide (SiC) instead of traditional silicon. It acts like a more efficient, tougher light switch that turns power on and off with less energy loss, withstands higher temperatures, and can be smaller. Investors care because these features can lower system costs, improve efficiency and performance, and drive demand in electric vehicles, renewable energy, and industrial power equipment.

aec-q100 technical

"AEC-Q100 qualified, integrated smart power stages with continuous current"

AEC‑Q100 is an industry qualification standard for integrated circuits used in vehicles, specifying a set of stress tests and environmental conditions chips must survive to be deemed reliable for automotive applications. For investors, AEC‑Q100 certification is like a durability and safety stamp — components that pass are more likely to win long-term auto contracts, face fewer recalls, and signal lower supply risk and steadier revenue for suppliers.

aec-q200 technical

"polymer tantalum capacitors qualified to AEC-Q200 with ultra low ESR"

AEC‑Q200 is an industry standard that defines stress tests and reliability requirements for passive electronic components (such as resistors, capacitors and inductors) used in vehicles. For investors, an AEC‑Q200 qualification signals that parts are designed and tested to survive harsh automotive conditions—like temperature swings, vibration and humidity—making products more likely to win automotive contracts and reduce warranty or field‑failure risk.

AI-generated analysis. How Rhea-AI works. Not financial advice.

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Company to Highlight Broad Portfolio of Semiconductor and Passive Technologies in a Series of Reference Designs and Product Demonstrations Focused on Grid to Board AI Power Delivery, Software-Defined Vehicles, and Humanoid Robotics

MALVERN, Pa., Aug. 26, 2026 (GLOBE NEWSWIRE) -- Vishay Intertechnology, Inc. (NYSE: VSH) today announced that the company will showcase its latest semiconductor and passive technologies at PCIM Asia 2026. In Hall 16, Booth C12, visitors are invited to explore Vishay's products and reference designs tailored to the rapidly evolving demands of AI infrastructure and physical AI applications.

At PCIM Asia, Vishay will highlight reference designs and products spanning the complete AI power architecture, from grid-level power infrastructure to board-level system power delivery. Featured exhibits will include solid-state transformers (SST), AC/DC power supply units (PSUs), high voltage DC (HVDC), DC/DC power conversion, battery backup units (BBUs), capacitor backup units (CBUs), hot-swap systems, software-defined vehicles (SDV), and humanoid robot motor control. Additional highlights will include automotive power modules for next-generation vehicle platforms.

For AI grid infrastructure, an SST reference design will feature components for input, DC blocking, output, and voltage balancing stages, including compact metallized polypropylene DC-Link film capacitors rated at 11 µF and 1800 V; high reliability power electronic capacitors up to 310 µF and 2000 V; four-terminal snap-in aluminum electrolytic capacitors with high ripple current and long life; non-inductive power resistors with working voltages up to 5000 V; and SiC MOSFET power modules in the EMIPAK 2B package. AC/DC PSU solutions will comprise Gen 5 E series MOSFETs for PFC and LLC stages; TrenchFET^® Gen V power MOSFETs for synchronous rectification and OR-ing applications; low profile rectifiers; low forward voltage bridge rectifiers; glass passivated rectifiers with high forward surge capability; SiC Schottky diodes optimized for high speed hard switching for clamp protection; and Power Metal Strip^® resistors for high power, low resistance current sensing. HVDC power conversion exhibits will highlight solutions for PFC, bootstrap, filtering, and precharge functions. Featured products will include Gen 4 SiC Schottky diodes with virtually no recovery tail, low switching losses, and a guaranteed minimum creepage distance of 3.2 mm; DC-Link film capacitors operating up to +125 °C with high ripple current capability and high humidity robustness; and PTC thermistors for inrush current limiting with energy absorption up to 300 J.

Board-level power conversion exhibits will consist of low profile PowerPAK^® SO-8DC MOSFET solutions that deliver high temperature operation up to +175 °C and combine low on-resistance with low gate and output charge for efficient switching, together with thick film chip resistors for gate-drive applications offering excellent pulse-load capability, enhanced power ratings, and double-sided printed resistor elements. BBU and CBU exhibits will feature edge-wound inductors with current capability up to 260 A and 350 V_DC coil to core isolation; IHDV power inductors rated up to 150 A with 1500 V_DC coil to core isolation; IHLP^® power inductors with current ratings up to 100 A; and output filter capacitors. Hot-swap systems will showcase power resistors for precharge and discharge applications rated up to 150 W with pulse absorption up to 75 J/0.1 s.

SDV exhibits will focus on POL converter, protection, and current sensing. Featured products will include AEC-Q100 qualified, integrated smart power stages with continuous current up to 50 A and peak current up to 80 A in the thermally enhanced PowerPAK MLP 5 x 6 package; polymer tantalum capacitors qualified to AEC-Q200 with ultra low ESR and 85 °C / 85 % RH rated voltage capability; Automotive Grade TVS devices with 7 kW surge protection and a flat clamping voltage; Ethernet ESD protection diodes compliant with OPEN Alliance specifications; 4-terminal current sense resistors with extremely low resistance values; and thermally enhanced MOSFETs for reverse protection. Humanoid robot motor control exhibits will demonstrate switching, gate-drive circuitry, and current sensing using MOSFETs in PowerPAK SO-8 and TOLL packages, 4-terminal shunt resistors with high power to 8 W, and an Automotive Grade inductor with a 200 V operating voltage rating. Automotive power module exhibits for EV / HEV charging stations and 48 V micromobility systems will feature SiC MOSFET / Si MOSFET power modules combining high blocking voltage, low on-resistance, high speed switching, and low capacitance, as well as half-bridge inverter modules integrating current and temperature sensing with an electrically isolated, exposed DBC substrate.

Addition reference designs being featured at PCIM Asia 2026 will include:

• Active discharge circuits with wirewound safety resistors and MOSFET drivers for 400 V / 800 V DC-Link capacitors
• An intelligent battery shunt built on WSBE Power Metal Strip^® resistors, with low TCR and a CAN FD interface for 400 V / 800 V systems
• A 48 V, 100 A resettable eFuse with adjustable current limiting and DC-Link capacitor pre-charge
• A single-stage, single-phase 480 µH EMI filter featuring a common mode choke and replaceable X and Y capacitors
• An active backup solution for 3.3 V systems featuring EDLC capacitors with charging and discharging currents up to 2.5 A

PCIM Asia 2026 will take place Aug. 26-28 at the Shenzhen World Exhibition and Convention Center in Shenzhen, China. More information on the event is available at https://pcimasia-shenzhen.cn.messefrankfurt.com/shenzhen/en.html.

# # #

Vishay manufactures one of the world’s largest portfolios of discrete semiconductors and passive electronic components that are essential to innovative designs in the automotive, industrial, computing, consumer, telecommunications, military, aerospace, and medical markets. Serving customers worldwide, Vishay is The DNA of tech.^® Vishay Intertechnology, Inc. is a Fortune 1000 Company listed on the NYSE (VSH). More on Vishay at www.Vishay.com.

The DNA of tech^® is a registered trademark of Vishay Intertechnology, Inc. Power Metal Strip and IHLP are registered trademarks of Vishay Intertechnology, Inc. PowerPAK and TrenchFET are registered trademarks of Siliconix incorporated.

Vishay on Facebook: http://www.facebook.com/VishayIntertechnology
Vishay Twitter feed: http://twitter.com/vishayindust

Link to The DNA of tech^® image:
https://www.flickr.com/photos/vishay/50342588442/sizes/l/

For more information please contact:
Vishay Intertechnology
Peter Henrici, +1 408 567-8400
peter.henrici@vishay.com
 or
Redpines
Bob Decker, +1 415 409-0233
bob.decker@redpinesgroup.com

FAQ

What is Vishay (NYSE: VSH) presenting at PCIM Asia 2026 for AI infrastructure?

Vishay is presenting semiconductor and passive components spanning AI power delivery from grid-level to board-level. According to Vishay, exhibits include solid-state transformers, AC/DC and HVDC conversion, DC/DC stages, battery and capacitor backup units, and hot-swap systems tailored to AI infrastructure demands.

When and where will Vishay showcase its AI and physical AI solutions at PCIM Asia 2026?

Vishay will showcase its solutions at PCIM Asia 2026 from Aug. 26-28, 2026 at the Shenzhen World Exhibition and Convention Center in Shenzhen, China. According to Vishay, its booth will be located in Hall 16, Booth C12.

Which Vishay products for software-defined vehicles will be highlighted at PCIM Asia 2026?

Vishay will highlight POL converter, protection, and current sensing solutions for software-defined vehicles. According to Vishay, featured products include AEC-Q100 qualified smart power stages up to 50 A, polymer tantalum capacitors, Automotive Grade TVS devices, Ethernet ESD protection diodes, current sense resistors, and MOSFETs for reverse protection.

What humanoid robot motor control solutions will Vishay demonstrate at PCIM Asia 2026?

Vishay will demonstrate humanoid robot motor control using MOSFETs, gate-drive circuitry, and current sensing components. According to Vishay, exhibits feature PowerPAK SO-8 and TOLL MOSFETs, 4-terminal shunt resistors up to 8 W, and an Automotive Grade inductor rated for 200 V operation.

How is Vishay addressing EV and 48 V micromobility power needs at PCIM Asia 2026?

Vishay is addressing EV/HEV and 48 V micromobility with automotive power modules. According to Vishay, these include SiC and Si MOSFET power modules with high blocking voltage and low on-resistance, plus half-bridge inverter modules integrating current and temperature sensing with electrically isolated DBC substrates.

What backup and protection reference designs from Vishay will be on display at PCIM Asia 2026?

Vishay will display multiple backup and protection reference designs, including active discharge circuits, intelligent battery shunts, resettable eFuses, EMI filters, and active backup solutions. According to Vishay, these designs target 400 V / 800 V systems and 3.3 V backup with defined current and energy ratings.