Taiwan Semiconductor Manufacturing Company Ltd. filings document the reporting framework of a foreign private issuer and ADR whose U.S. disclosures include Form 6-K current reports and annual Form 20-F materials. The filings cover consolidated revenue reports, quarterly earnings presentations, accounting differences between Taiwan-IFRSs and IASB-issued IFRSs, and operating results for the company's semiconductor foundry business.
TSMC's regulatory disclosures also address shareholder meeting agendas, business reports and financial statements, Audit and Risk Committee review materials, earnings distribution, directors' compensation, employee profit-sharing bonuses, amendments to corporate procedures, unsecured bond issuance, asset acquisitions and dispositions, capital appropriations, share cancellations, and changes in shareholdings or pledges by directors, executive officers and large shareholders.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD executive Liaw Yung-Haw, a vice president, filed an initial Form 3 reporting existing ownership of the company’s common shares. The filing shows direct holdings of 463,054 common shares, plus additional indirect holdings through an ESPP trust, an LTI bonus plan trust, and Hsing Yu Investment Co., Ltd.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD executive Chris Horng-Dar Lin, VP and CIO, filed an initial ownership report showing his equity stake. He holds 128,184 Common Shares (2330.TW) and 2,800 American Depositary Shares (TSM) directly, with each ADS representing five Common Shares.
He also reports indirect ownership of Common Shares through an Employee Stock Purchase Plan trust holding 5,679 shares and an LTI Bonus Plan trust holding 7,036 shares. Additional indirect holdings are 15,000 Common Shares and 3,560 ADS held by his spouse, plus 8,460 ADS held by a family trust.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD executive Yuh-Jier Mii, EVP and Co-COO, filed an initial ownership report. The filing shows direct ownership of 1,254,057 Common Shares (2330.TW) and 25 American Depositary Shares. Additional Common Shares are held indirectly through an ESPP trust and an LTI bonus plan trust.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD VP Shyue-Shyh Lin has filed an initial Form 3 reporting ownership of the company’s common shares. Lin holds 21,269 common shares directly, 53 shares indirectly through an Employee Stock Purchase Plan trust, and 4,000 shares indirectly through a spouse.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD VP Bor-Zen Tien reported existing equity holdings in a Form 3. The filing lists 8,051 Common Shares (2330.TW) held directly, 70 American Depositary Shares, and additional indirect Common Share holdings through an ESPP trust and an immediate family member.
It also discloses Equity Linked Notes issued by Goldman Sachs International referencing a basket that includes TSM ADS, with potential settlement of up to 71 ADS at a strike price of US$278.8973 per ADS if certain conditions are met by June 3, 2026.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD executive Lu Lee-Chung, a VP, reported existing ownership of the company’s Common Shares (2330.TW) in an initial insider filing. The Form 3 lists 276,716 shares held directly, plus indirect holdings through various plans and a spouse.
Indirect interests include 6,162 shares held by an Employee Stock Purchase Plan trust, 7,036 shares in a Long-Term Incentive bonus plan trust over which the filer has investment control, and 15,000 shares held by a spouse. The filing records ownership positions only, with no new buy or sell transactions.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD VP Yuan Lipen filed an initial ownership report showing holdings of the company’s common shares. The filing lists 3,000 shares held directly, 1,040 shares held indirectly through an Employee Stock Purchase Plan trust, and 1,650 shares held indirectly through a spouse. Some of these shares were acquired under the issuer's Employee Stock Purchase Plan.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD senior vice president Shien-Yang Wu filed an initial Form 3 reporting existing equity holdings. He directly holds 630,228 Common Shares (2330.TW) and has additional indirect interests through an ESPP trust, an LTI trust, and spouse-held accounts, including American Depositary Shares where each ADS represents five Common Shares.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD senior vice president Wang Ying-Lang filed an initial Form 3 reporting his ownership of the company’s common shares. This filing lists existing holdings rather than new market transactions.
He reports direct ownership of 362,392 common shares (2330.TW). Indirectly, he is shown with 6,155 shares held through an Employee Stock Purchase Plan trust, 10,581 shares held by a Long-Term Incentive bonus plan trust over which he has investment control, and 1,135,529 shares held by his spouse.
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD senior vice president Yeap Choh Fei has filed an initial Form 3 reporting beneficial ownership of the company’s common shares. The filing shows direct ownership of 212,375 common shares, plus indirect interests of 6,201 shares held by an Employee Stock Purchase Plan trust and 10,581 shares held by a Long-Term Incentive bonus plan trust. These entries reflect reported holdings as of the filing date, with no buy or sell transactions disclosed.