Veeco’s Laser Annealing Platform Named Production Tool of Record for New Applications at Leading-Edge Logic Manufacturers
Veeco Instruments (NASDAQ: VECO) announced that two leading-edge logic manufacturers have selected its Laser Spike Annealing (LSA) Platform as Production Tool of Record for new applications at their gate-all-around nodes. The company anticipates high-volume manufacturing orders as customers ramp up advanced nodes production.
The LSA platform, recognized for optimal annealing in low thermal-budget applications, performs millisecond annealing in front-end semiconductor manufacturing to reduce resistance in transistor structures through dopant activation. The technology portfolio includes the NSA500 system, extending capabilities to Backside Power Delivery and Contact Annealing for advanced nodes.
These selections represent successful ongoing collaborations and validate Veeco's strategy to expand its Served Available Market through leading-edge investments.
Veeco Instruments (NASDAQ: VECO) ha annunciato che due produttori di logica all'avanguardia hanno scelto la sua piattaforma Laser Spike Annealing (LSA) come strumento di produzione ufficiale per nuove applicazioni nei loro nodi gate-all-around. L'azienda prevede ordini di produzione ad alto volume con l'aumento della produzione di nodi avanzati.
La piattaforma LSA, riconosciuta per l'annealing ottimale in applicazioni a basso budget termico, esegue un annealing in millisecondi nella produzione front-end dei semiconduttori per ridurre la resistenza nelle strutture dei transistor tramite l'attivazione del drogaggio. Il portafoglio tecnologico include il sistema NSA500, che estende le capacità alla distribuzione di potenza posteriore e all'annealing dei contatti per nodi avanzati.
Queste scelte rappresentano collaborazioni di successo in corso e confermano la strategia di Veeco di espandere il proprio mercato disponibile servito attraverso investimenti all'avanguardia.
Veeco Instruments (NASDAQ: VECO) anunció que dos fabricantes líderes de lógica avanzada han seleccionado su plataforma Laser Spike Annealing (LSA) como herramienta de producción oficial para nuevas aplicaciones en sus nodos gate-all-around. La empresa anticipa pedidos de fabricación en volumen alto a medida que los clientes aumentan la producción de nodos avanzados.
La plataforma LSA, reconocida por su recocido óptimo en aplicaciones de bajo presupuesto térmico, realiza un recocido en milisegundos en la fabricación front-end de semiconductores para reducir la resistencia en las estructuras de los transistores mediante la activación de dopantes. El portafolio tecnológico incluye el sistema NSA500, que extiende las capacidades a la entrega de energía trasera y al recocido de contactos para nodos avanzados.
Estas selecciones representan colaboraciones exitosas en curso y validan la estrategia de Veeco para expandir su mercado disponible servido a través de inversiones de vanguardia.
Veeco Instruments (NASDAQ: VECO)는 두 개의 첨단 로직 제조업체가 게이트 올 어라운드 노드의 새로운 응용 분야를 위해 자사의 레이저 스파이크 어닐링(LSA) 플랫폼을 생산 도구로 선정했다고 발표했습니다. 회사는 고객이 첨단 노드 생산을 확대함에 따라 대량 생산 주문을 기대하고 있습니다.
LSA 플랫폼은 낮은 열 예산 애플리케이션에서 최적의 어닐링으로 인정받으며, 반도체 전면 제조 과정에서 밀리초 단위의 어닐링을 수행하여 도펀트 활성화를 통해 트랜지스터 구조의 저항을 줄입니다. 기술 포트폴리오에는 첨단 노드를 위한 백사이드 전력 공급 및 접촉 어닐링 기능을 확장하는 NSA500 시스템이 포함되어 있습니다.
이러한 선정은 성공적인 지속 협력을 나타내며, Veeco가 첨단 투자로 서비스 가능한 시장을 확장하려는 전략을 입증합니다.
Veeco Instruments (NASDAQ : VECO) a annoncé que deux fabricants de circuits logiques de pointe ont choisi sa plateforme Laser Spike Annealing (LSA) comme outil de production officiel pour de nouvelles applications sur leurs nœuds gate-all-around. L'entreprise anticipe des commandes de production en grande série à mesure que ses clients augmentent la fabrication de nœuds avancés.
La plateforme LSA, reconnue pour son recuit optimal dans les applications à faible budget thermique, réalise un recuit en millisecondes en fabrication front-end de semi-conducteurs afin de réduire la résistance dans les structures de transistors via l'activation des dopants. Le portefeuille technologique comprend le système NSA500, qui étend les capacités à l'alimentation arrière et au recuit des contacts pour les nœuds avancés.
Ces sélections témoignent de collaborations réussies en cours et valident la stratégie de Veeco visant à étendre son marché disponible servi grâce à des investissements de pointe.
Veeco Instruments (NASDAQ: VECO) gab bekannt, dass zwei führende Logikhersteller seine Laser Spike Annealing (LSA) Plattform als Produktionstool für neue Anwendungen bei ihren Gate-All-Around-Knoten ausgewählt haben. Das Unternehmen erwartet Großserienaufträge, da die Kunden die Produktion fortschrittlicher Knoten hochfahren.
Die LSA-Plattform, bekannt für optimales Glühen bei Anwendungen mit geringem thermischen Budget, führt Millisekunden-Glühen in der Front-End-Halbleiterfertigung durch, um den Widerstand in Transistorstrukturen durch Dotieraktivierung zu reduzieren. Das Technologieportfolio umfasst das NSA500-System, das die Fähigkeiten auf Backside Power Delivery und Kontaktglühen für fortschrittliche Knoten erweitert.
Diese Auswahlen spiegeln erfolgreiche laufende Kooperationen wider und bestätigen Veecos Strategie, seinen bedienten verfügbaren Markt durch führende Investitionen zu erweitern.
- Secured two major customer wins for LSA Platform at leading-edge logic manufacturers
- Expected high-volume manufacturing orders from both customers
- Strategic expansion into new market applications
- None.
Insights
Veeco secured two tool-of-record wins for advanced semiconductor nodes, validating their tech strategy and expanding market reach.
Veeco's announcement reveals two significant customer wins, with leading-edge logic customers selecting their Laser Spike Annealing (LSA) Platform as the Production Tool of Record for new applications at gate-all-around (GAA) nodes. This designation is technically significant as it confirms Veeco's technology meets the stringent requirements for advanced semiconductor manufacturing processes.
The company expects high-volume manufacturing orders tied to these wins as customers ramp their advanced nodes into production. This represents execution of Veeco's stated strategy of "expanding its Served Available Market by investing at the leading-edge," as directly mentioned in the release.
From a technical perspective, Veeco's LSA system addresses a critical manufacturing challenge - the need for millisecond annealing technology that activates dopants while maintaining the reduced thermal budgets required by increasingly complex device architectures. As the article notes, "as device geometries and performance requirements at advanced nodes continue to evolve, precise annealing by our LSA platform has become increasingly critical."
The article also highlights Veeco's broader annealing portfolio, including their NSA500 system, which extends capabilities to applications like Backside Power Delivery and Contact Annealing at advanced nodes - technologies that play instrumental roles in determining electrical properties and performance of resulting devices.
Veeco's tool-of-record wins strengthen its position in advanced semiconductor manufacturing supply chains at critical GAA nodes.
These tool-of-record designations position Veeco at a strategic inflection point in semiconductor manufacturing. The transition to gate-all-around (GAA) architectures represents one of the most significant shifts in transistor design in recent years, requiring new approaches to thermal processing.
By securing these positions with two leading-edge logic customers, Veeco demonstrates that its annealing technology addresses critical manufacturing challenges at advanced nodes. The millisecond annealing capability mentioned in the article is particularly valuable for these complex architectures where traditional thermal processes may damage sensitive structures.
The supply chain significance extends beyond the immediate tool placements. As the article states, Veeco "expects high-volume manufacturing orders tied to these wins" as customers ramp production, indicating these design wins should translate to material equipment shipments as these nodes mature.
Veeco's technology portfolio appears to address both current and emerging needs in semiconductor thermal processing. The article specifically mentions capabilities for Backside Power Delivery applications, which aligns with industry advancements in chip architecture. The application areas cited - "void-removal, recrystallization, and grain growth" - all represent critical steps in semiconductor manufacturing where precise thermal control directly impacts device performance and reliability.
PLAINVIEW, N.Y., April 28, 2025 (GLOBE NEWSWIRE) -- Veeco Instruments Inc. (NASDAQ: VECO) announced today two leading-edge logic customers have selected Veeco’s Laser Spike Annealing Platform as Production Tool of Record for new applications at their gate-all-around nodes. Veeco expects high-volume manufacturing orders tied to these wins as each customer ramps their advanced nodes.
“We continue to see growing adoption of our laser annealing platform for new applications as demonstrated by today’s announcement,” commented Adrian Devasahayam, Ph.D., Veeco’s Senior Vice President, Product Line Management. “Veeco's LSA system is widely acknowledged as the optimum annealing solution for low thermal-budget applications, and as device geometries and performance requirements at advanced nodes continue to evolve, precise annealing by our LSA platform has become increasingly critical. Both wins are a culmination of ongoing collaboration with each customer and validate Veeco’s strategy of expanding its Served Available Market by investing at the leading-edge.”
Laser spike annealing is a millisecond annealing technology used in front-end semiconductor manufacturing to lower the resistance of key transistor structures by activating dopants. Veeco’s LSA system is capable of high temperature annealing while staying within reduced thermal budgets of advanced devices at leading-edge nodes. Veeco’s Laser Annealing portfolio also includes its NSA500 system, which extends annealing capabilities to low thermal budget applications, like Backside Power Delivery and Contact Annealing for advanced nodes and material modification applications such as void-removal, recrystallization, and grain growth. These annealing steps are instrumental in determining the electrical properties and performance of the resulting devices.
About Veeco
Veeco (NASDAQ: VECO) is an innovative manufacturer of semiconductor process equipment. Our laser annealing, ion beam, single wafer etch & clean, lithography, and metal organic chemical vapor deposition (MOCVD) technologies play an integral role in the fabrication and packaging of advanced semiconductor devices. With equipment designed to optimize performance, yield and cost of ownership, Veeco holds leading technology positions in the markets we serve. To learn more about Veeco’s systems and service offerings, visit www.veeco.com.
To the extent that this news release discusses expectations or otherwise makes statements about the future, such statements are forward-looking and are subject to a number of risks and uncertainties that could cause actual results to differ materially from the statements made. These factors include the risks discussed in the Business Description and Management's Discussion and Analysis sections of Veeco's Annual Report on Form 10-K for the year ended December 31, 2024 and in our subsequent quarterly reports on Form 10-Q, current reports on Form 8-K and press releases. Veeco does not undertake any obligation to update any forward-looking statements to reflect future events or circumstances after the date of such statements.
Veeco Contacts:
Investors: Anthony Pappone | (516) 500-8798 | apappone@veeco.com
Media: Javier Banos | (516) 673-7328 | jbanos@veeco.com 
FAQ
What is the significance of Veeco's LSA Platform being selected as Production Tool of Record?
How does Veeco's Laser Spike Annealing (LSA) technology work in semiconductor manufacturing?
What applications does Veeco's NSA500 system support in semiconductor manufacturing?
What market expansion strategy is VECO pursuing with its laser annealing technology?
